Abstract: Filaments that contain a filament-forming material and an additive, nonwoven webs, and methods for making such filaments are provided.

Abstract: A method for delivering one or more oral care active agents to a mammal's mouth using a nonwoven web of filaments and/or fibers containing one or more oral care active agents that are releasable from the filaments and/or fibers is provided.

Abstract: A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Abstract: A sensor cover is disclosed for camouflaging a high frequency sensor, including for example, a radar sensor. The sensor cover includes a substrate having a non-planar surface with non-signal transmitting regions and signal transmitting regions. A metal layer is disposed on each of the non-signal transmitting regions. Further, each of the non-signal transmitting regions is separated by one of the signal transmitting regions. The method of constructing such a sensor cover is also disclosed.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: A sensor cover is disclosed for camouflaging a high frequency sensor, including for example, a radar sensor. The sensor cover includes a substrate having a non-planar surface with non-signal transmitting regions and signal transmitting regions. A metal layer is disposed on each of the non-signal transmitting regions. Further, each of the non-signal transmitting regions is separated by one of the signal transmitting regions. The method of constructing such a sensor cover is also disclosed.

Abstract: A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Abstract: A method 10 for producing a circuit assembly 30 having a polymeric member 14 upon which conductors, such as conductors 64, may be easily and selectively interconnected to another circuit assembly device, and/or apparatus.

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract: A method for making multi-layer electronic circuit board including a pre-circuit assembly 12 and a ground layer 14 which are automatically aligned and bonded together by use of solder material or deposits 26, 28.

Abstract: A method for making a multi-layer electronic circuit board 136 having electroplated apertures 96, 98 which may be selectively and electrically isolated from an electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 128 which are structurally supported by material 134.

Abstract: A method 10, 110 for making multi-layer electronic circuit boards 82, 148 having metallized apertures 18, 20, 118, 120 which may be selectively and electrically connected to a source of ground potential.

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract: Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

Abstract: A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.