Patents by Inventor Robert Joseph Hill

Robert Joseph Hill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR WIRELESS COMMUNICATIONS IN HEAD-MOUNTED DEVICES
    Publication number: 20230378989
    Abstract: An electronic device has a frame configured to be worn on a user's head, where the frame includes a body and a temple coupled to the body. The body is configured to support a lens. The electronic device includes a processor in the frame and an RF antenna positioned in the body and in data communication with the processor.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Inventors: Yijun ZHOU, Heesuk CHUNG, Qingxiang LI, Abrian Jacob MIHALKO, Mohit NARANG, Rubén CABALLERO, Robert Joseph HILL
  • Antenna Design And Manufacturing For Smart Glasses Antennas
    Publication number: 20230041962
    Abstract: Metallic, electrically conductive, structures on smart glasses, which can be utilized to provide structural integrity and/or thermal dissipation capability, can be leveraged to provide antenna capability as well. Metallic structures on smart glasses are utilized as antenna grounds, with corresponding antenna elements being electrically coupled thereto, and located on the glasses temple. Such antenna elements implement folded antennas having an antenna length selected in accordance with desired communicational frequencies. A shorting pin establishes the electrical connection to the antenna ground. Metallic structures on smart glasses are also utilized as antenna elements, with different metallic structures acting as the antenna ground. Such antenna elements implement monopole antennas having a length selected in accordance with desired communicational frequencies, and a width that can maintain structural integrity and/or thermal dissipation capability.
    Type: Application
    Filed: August 3, 2021
    Publication date: February 9, 2023
    Inventors: Yijun ZHOU, Robert Joseph HILL, Qingxiang LI, Heesuk CHUNG, Daejoung KIM, Venkata Vishnu GURUKULA, Mohit NARANG, Rubén CABALLERO
  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 7049682
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: May 23, 2006
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan
  • Multi-chip semiconductor package with integral shield and antenna
    Patent number: 6686649
    Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: February 3, 2004
    Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AG
    Inventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan