Patents by Inventor Robert Joseph Roessler

Robert Joseph Roessler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10827602
    Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: November 3, 2020
    Assignee: ABB Power Electronics Inc.
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Patent number: 10820420
    Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 27, 2020
    Assignee: ABB POWER ELECTRONICS INC.
    Inventor: Robert Joseph Roessler
  • Publication number: 20190343001
    Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventor: Robert Joseph Roessler
  • Publication number: 20190311840
    Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.
    Type: Application
    Filed: April 9, 2018
    Publication date: October 10, 2019
    Inventors: Robert Joseph Roessler, Anjana Shyamsundar
  • Patent number: 10356906
    Abstract: A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: July 16, 2019
    Assignee: ABB SCHWEIZ AG
    Inventor: Robert Joseph Roessler
  • Publication number: 20170367185
    Abstract: A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 21, 2017
    Inventor: Robert Joseph Roessler
  • Patent number: 9844136
    Abstract: A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: December 12, 2017
    Assignee: GENERAL ELECTRIC COMPANY
    Inventor: Robert Joseph Roessler
  • Publication number: 20160157347
    Abstract: A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventor: Robert Joseph Roessler
  • Patent number: 7656265
    Abstract: An apparatus for establishing at least one turn for a magnetic circuit includes: (a) at least one first magnetic element oriented substantially about an axis generally between a first axial position and a second axial position; and (b) at least one second magnetic element coupled with at least one selected first magnetic element of the at least one first magnetic element generally at the second axial position. The at least one second magnetic element establishes at least one return magnetic path from the second axial position generally toward the first axial position. The at least one return magnetic path is generally about the axis.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: February 2, 2010
    Assignee: Lineage Power Corporation
    Inventors: Robert James Catalano, Robert Joseph Roessler, Karim Nashaat Wassef
  • Patent number: 6727794
    Abstract: An apparatus for establishing inductive coupling in an electrical circuit arranged on a plurality of dielectric substrates, the substrates being in a substantially abutting relationship and presenting a plurality of substantially parallel planar expanses, includes: (a) at least one first core segment situated in at least one first depression provided in a first planar expanse; (b) at least one second core segment situated in at least one second depression provided in a second planar expanse; (c) a selected second core segment is arranged for establishing magnetic flux coupling with a selected first core segment to establish a magnetic core structure; (d) a plurality of electrically conductive through-hole structures traverse at least one substrate; (e) a plurality of electrically conductive circuit traces are arrayed upon at least two of the planar expanses. The conductive traces and the through-hole structures cooperate to establish inductive coupling.
    Type: Grant
    Filed: September 22, 2001
    Date of Patent: April 27, 2004
    Assignee: Tyco Electronics Logistics, A.G.
    Inventors: Galliano Ricardo Busletta, Peter Mignano, Robert Joseph Roessler, Matthew Anthony Wilkowski
  • Patent number: 6597271
    Abstract: An electromagnetic apparatus having an adjusting effective core gap includes: (a) an electrical winding; and (b) a ferrous core situated proximal with the electrical winding. The core has a first terminus and a second terminus arranged in spaced relation to establish a gap distance between the termini in a region in substantial register with the termini. The winding and the core cooperate to establish an inductance related with an electrical current applied to the winding. At least one terminus of the termini has a configuration responsive to varying the current by effecting selective local saturation of successive portions of the at least one terminus for successive values of the current. The selective local saturation establishes successive new effective gap distances. Each respective new effective gap distance is appropriate for establishing a successive new optimum inductance for the current value then extant.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: July 22, 2003
    Inventors: Galliano Riccardo Busletta, Robert Joseph Roessler, Karim Nashaat Wassef, Matthew Anthony Wilkowski
  • Publication number: 20030071705
    Abstract: An electromagnetic apparatus having an adjusting effective core gap includes: (a) an electrical winding; and (b) a ferrous core situated proximal with the electrical winding. The core has a first terminus and a second terminus arranged in spaced relation to establish a gap distance between the termini in a region in substantial register with the termini. The winding and the core cooperate to establish an inductance related with an electrical current applied to the winding. At least one terminus of the termini has a configuration responsive to varying the current by effecting selective local saturation of successive portions of the at least one terminus for successive values of the current. The selective local saturation establishes successive new effective gap distances. Each respective new effective gap distance is appropriate for establishing a successive new optimum inductance for the current value then extant.
    Type: Application
    Filed: October 12, 2001
    Publication date: April 17, 2003
    Inventors: Galliano Riccardo Busletta, Robert Joseph Roessler, Karim Nashaat Wassef, Matthew Anthony Wilkowski
  • Publication number: 20030058078
    Abstract: An apparatus for establishing inductive coupling in an electrical circuit arranged on a plurality of dielectric substrates, the substrates being in a substantially abutting relationship and presenting a plurality of substantially parallel planar expanses, includes: (a) at least one first core segment situated in at least one first depression provided in a first planar expanse; (b) at least one second core segment situated in at least one second depression provided in a second planar expanse; (c) a selected second core segment is arranged for establishing magnetic flux coupling with a selected first core segment to establish a magnetic core structure; (d) a plurality of electrically conductive through-hole structures traverse at least one substrate; (e) a plurality of electrically conductive circuit traces are arrayed upon at least two of the planar expanses. The conductive traces and the through-hole structures cooperate to establish inductive coupling.
    Type: Application
    Filed: September 22, 2001
    Publication date: March 27, 2003
    Inventors: Galliano Riccardo Busletta, Peter Mignano, Robert Joseph Roessler, Matthew Anthony Wilkowski
  • Patent number: 6377150
    Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation.
    Type: Grant
    Filed: July 13, 2000
    Date of Patent: April 23, 2002
    Inventors: Randy Thomas Heinrich, Robert Joseph Roessler, David Leonard Stevens, Matthew Anthony Wilkowski, William Lonzo Woods
  • Patent number: 6335671
    Abstract: A surface mount core assembly comprises a header with breakaway support rails. The breakaway support rails are used in the manufacturing process to maximize the core window of the assembly, and may be removed to minimize the footprint of the assembly. In the present embodiment, the assembly comprises, for example, a transformer wherein prefabricated conductor rings are used to further maximize the fill of the core window with conductor material.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: January 1, 2002
    Assignee: Tyco Electronics Logistics AG
    Inventors: Robert Joseph Roessler, Matthew Anthony Wilkowski, William Lonzo Woods, Jr., Arthur R. Martin
  • Patent number: 6262649
    Abstract: A surface-mountable magnetic device comprising: (1) a multi-layer circuit containing a plurality of windings disposed in layers thereof, the multi-layer circuit having first and second lateral recesses associated therewith, the first and second lateral recesses intersecting the layers of the multi-layer circuit, (2) a conductive substance disposed within the first and second lateral recesses and electrically coupling selected ones of the plurality of windings and (3) a magnetic core mounted proximate the plurality of windings, the magnetic core adapted to impart a desired magnetic property to the plurality of windings, the device locatable proximate a substantially planar substrate to allow the first and second lateral recesses to act as conductors between the plurality of windings and electrical conductors on the substantially planar substrate, the plurality of windings and the magnetic core substantially free of a surrounding molding material to allow the magnetic device to assume a smaller overall device v
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: July 17, 2001
    Assignee: Tyco Electronics Logistics AG
    Inventors: Robert Joseph Roessler, Lennart Daniel Pitzele
  • Patent number: 6239683
    Abstract: A post-mountable magnetic device comprising: (1) first and second conductive posts mountable to a substantially planar substrate, (2) a plurality of windings coupled to the first and second conductive posts, each of the plurality of windings having first and second conductive termination apertures at predetermined locations thereon, the first and second conductive termination apertures of the plurality of windings engaging and registering with the first and second conductive posts, respectively, the first and second conductive posts electrically coupling the plurality of windings, the first and second conductive posts therefore substantially within a footprint of the magnetic device and (3) a magnetic core mounted proximate the plurality of windings, the magnetic core adapted to impart a desired magnetic property to the plurality of windings, the plurality of windings and the magnetic core substantially free of a molding material to allow the magnetic device to assume a smaller overall device volume.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 29, 2001
    Assignee: Tyco Electronics Logistics A.G.
    Inventors: Robert Joseph Roessler, Lennart Daniel Pitzele
  • Patent number: 6212071
    Abstract: A cooling system for a circuit board employs a heat-conducing channel within the board. The channel is thermally coupled to an electrical device mounted on the board, and leads to an edge of the board. The edge of the board is coupled to a heat-dissipating can. The use of channels leading to the edges of the board allows a single can to dissipate heat for a plurality of boards and a plurality of devices.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: April 3, 2001
    Assignee: Lucent Technologies, Inc.
    Inventors: Robert Joseph Roessler, William Lonzo Woods, Jr.
  • Patent number: 6138344
    Abstract: Methods of manufacturing a magnetic device and a manufacturing tool employing the methods. One of the methods includes the steps of: (1) providing a planar winding assembly and (2) employing an automated pick and placement tool adhesively to secure a first core-portion of a magnetic core to a second core-portion thereof proximate the planar winding assembly, the magnetic core adapted to impart a desired magnetic property to the planar winding assembly, the first and second core-portions being secured to said planar winding assembly without substantial compressive forces.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: October 31, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Robert Joseph Roessler, William Lonzo Woods
  • Patent number: 6128817
    Abstract: A surface-mountable magnetic device comprising: (1) a multi-layer circuit containing a plurality of windings disposed in layers thereof, the multi-layer circuit having first and second lateral recesses associated therewith, the first and second lateral recesses intersecting the layers of the multi-layer circuit, (2) a conductive substance disposed within the first and second lateral recesses and electrically coupling selected ones of the plurality of windings and (3) a magnetic core mounted proximate the plurality of windings, the magnetic core adapted to impart a desired magnetic property to the plurality of windings, the device locatable proximate a substantially planar substrate to allow the first and second lateral recesses to act as conductors between the plurality of windings and electrical conductors on the substantially planar substrate, the plurality of windings and the magnetic core substantially free of a surrounding molding material to allow the magnetic device to assume a smaller overall device v
    Type: Grant
    Filed: March 20, 1998
    Date of Patent: October 10, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Robert Joseph Roessler, Lennart Daniel Pitzele