Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

Abstract: In one aspect, a PCB is provided. The PCB includes at least one insulating layer, a blind slot, and at least one via. The at least on insulating layer includes a first surface and a second surface opposite the first surface. The blind slot is plated and formed in the at least one insulating layer, where the blind slot partially extends from the first surface to the second surface, and where the blind slot includes a conductive plating bonded along a major surface of the blind slot. The at least one via is electrically conductive and filled, where the at least one via is coupled with and extends between the conductive plating of the blind slot and the second surface of the at least one insulating layer.

Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.

Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.

Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.

Abstract: At least one embodiment of a power supply includes a printed circuit board formed from a plurality of double-sided laminates and a plurality of thermally conductive, electrically insulating pre-preg sheets interleaved with the plurality of double-sided laminates. Each double-sided laminate illustratively includes an electrically insulating core, a first patterned layer of electrically conductive material arranged on a first side of the electrically insulating core, and a second patterned layer of electrically conductive material arranged on a second side of the electrically insulating core opposite the first side.

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).

Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).

Abstract: A magnetic assembly includes a magnetic core including at least one winding leg and at least one winding. The at least one winding inductively coupled to the magnetic core and wound around the at least one winding leg. The at least one winding includes a foil conductive material and a tape. The tape includes a thermally conductive adhesive layer and an electrically insulating layer.

Abstract: A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.

Abstract: A method of manufacturing a printed circuit board includes providing a printed circuit board (PCB) substrate including at least one insulating layer and first and second conductive layers separated from one another by the at least one insulating layer, forming a first via hole in the PCB substrate extending from the first conductive layer to the second conductive layer, where the first via hole is defined by a first sidewall of the PCB substrate, forming a second via hole in the PCB substrate, where the second via hole is defined by a second sidewall of the PCB substrate, and selectively plating the first sidewall and the second sidewall to form a first via and a second via, respectively, where the first via and the second via have different via sidewall thicknesses.

Abstract: A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.

Abstract: A multilayer printed circuit board is provided. The multilayer printed circuit board includes a core, a first conductive layer coupled to the core, an insulating layer covering the first conductive layer, and a second conductive layer spaced from the first conductive layer by the insulating layer. The first conductive layer includes a first portion having a first thickness and a second portion having a second thickness greater than the first thickness. The second conductive layer is electrically coupled to the second portion of the first conductive layer by a conductive via extending through the insulating layer.

Abstract: An apparatus for establishing at least one turn for a magnetic circuit includes: (a) at least one first magnetic element oriented substantially about an axis generally between a first axial position and a second axial position; and (b) at least one second magnetic element coupled with at least one selected first magnetic element of the at least one first magnetic element generally at the second axial position. The at least one second magnetic element establishes at least one return magnetic path from the second axial position generally toward the first axial position. The at least one return magnetic path is generally about the axis.

Abstract: An apparatus for establishing inductive coupling in an electrical circuit arranged on a plurality of dielectric substrates, the substrates being in a substantially abutting relationship and presenting a plurality of substantially parallel planar expanses, includes: (a) at least one first core segment situated in at least one first depression provided in a first planar expanse; (b) at least one second core segment situated in at least one second depression provided in a second planar expanse; (c) a selected second core segment is arranged for establishing magnetic flux coupling with a selected first core segment to establish a magnetic core structure; (d) a plurality of electrically conductive through-hole structures traverse at least one substrate; (e) a plurality of electrically conductive circuit traces are arrayed upon at least two of the planar expanses. The conductive traces and the through-hole structures cooperate to establish inductive coupling.

Abstract: An electromagnetic apparatus having an adjusting effective core gap includes: (a) an electrical winding; and (b) a ferrous core situated proximal with the electrical winding. The core has a first terminus and a second terminus arranged in spaced relation to establish a gap distance between the termini in a region in substantial register with the termini. The winding and the core cooperate to establish an inductance related with an electrical current applied to the winding. At least one terminus of the termini has a configuration responsive to varying the current by effecting selective local saturation of successive portions of the at least one terminus for successive values of the current. The selective local saturation establishes successive new effective gap distances. Each respective new effective gap distance is appropriate for establishing a successive new optimum inductance for the current value then extant.

Abstract: An electromagnetic apparatus having an adjusting effective core gap includes: (a) an electrical winding; and (b) a ferrous core situated proximal with the electrical winding. The core has a first terminus and a second terminus arranged in spaced relation to establish a gap distance between the termini in a region in substantial register with the termini. The winding and the core cooperate to establish an inductance related with an electrical current applied to the winding. At least one terminus of the termini has a configuration responsive to varying the current by effecting selective local saturation of successive portions of the at least one terminus for successive values of the current. The selective local saturation establishes successive new effective gap distances. Each respective new effective gap distance is appropriate for establishing a successive new optimum inductance for the current value then extant.

Abstract: An apparatus for establishing inductive coupling in an electrical circuit arranged on a plurality of dielectric substrates, the substrates being in a substantially abutting relationship and presenting a plurality of substantially parallel planar expanses, includes: (a) at least one first core segment situated in at least one first depression provided in a first planar expanse; (b) at least one second core segment situated in at least one second depression provided in a second planar expanse; (c) a selected second core segment is arranged for establishing magnetic flux coupling with a selected first core segment to establish a magnetic core structure; (d) a plurality of electrically conductive through-hole structures traverse at least one substrate; (e) a plurality of electrically conductive circuit traces are arrayed upon at least two of the planar expanses. The conductive traces and the through-hole structures cooperate to establish inductive coupling.

Abstract: An apparatus is disclosed for facilitating heat dissipation in an electrical device hat includes a core structure traversing a substrate when the core structure is in an installed orientation. The apparatus comprises: (a) at least one aperture through the substrate for accommodating traversing by the core structure; each respective aperture has periphery defined by a respective circumjacent face extending a height substantially equal with the substrate thickness; (b) a layer of thermally conductive material situated discontinuously on the circumjacent face of at least one respective aperture. The respective aperture is configured to establish a thermally conductive engagement with at least one facing portion of the core structure traversing the respective aperture in the installed orientation.

Abstract: A surface mount core assembly comprises a header with breakaway support rails. The breakaway support rails are used in the manufacturing process to maximize the core window of the assembly, and may be removed to minimize the footprint of the assembly. In the present embodiment, the assembly comprises, for example, a transformer wherein prefabricated conductor rings are used to further maximize the fill of the core window with conductor material.