Patents by Inventor Robert K. DeHaven

Robert K. DeHaven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip semiconductor device and method for making the device by using multiple flip chip interfaces
    Patent number: 6150724
    Abstract: A bump-bonded multi-chip flip-chip device (100) is formed by manufacturing a mother chip (102) having a first set (207) of bumps (212) and a second set (209) of bump contacts (210). A daughter chip (104) is also formed which has conductive bumps (312). The daughter chip (104) and the mother chip (102) are placed face-to-face and contact is made between the daughter chips bumps (312) and the mother chips bump contact regions (210). After interconnection of the daughter chip (104) and the mother chip (102), the mother chip (102) is contacted to an IC package (106) using the bumps (212). The package (106) uses a plurality of metallic layers interconnected selectively by conductive vias in order to route signals between the mother chip (102), the daughter chip (104), and external terminals (112) of the package (106).
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: November 21, 2000
    Assignee: Motorola, Inc.
    Inventors: James F. Wenzel, Robert K. DeHaven, Bryan D. Marietta, James P. Johnston