Abstract: A plug comprises power contacts and a trip jumper having jumper contacts configured to make a trip connection, during a plugging action with the plug and a receptacle, with mating trip contacts in the receptacle. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of a receptacle power contact from the power. A receptacle comprises receptacle power contacts and a trip circuit having receptacle trip contacts configured to make a trip connection, during a plugging action with the receptacle and plug, with mating trip contacts in the plug. When the receptacle is connected to electrical power during the plugging action, a current over the trip connection can cause disconnection of power to a receptacle power contact. A system can have an electrical device with a line cord connected to the plug.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: An apparatus for positioning service element interface devices is provided. A gate is affixed to a computing rack by a gate hinge, wherein the gate hinge rotates on a first axis. A first tray affixed to the gate at a side edge of the first tray. A second tray affixed to the first tray at a bottom edge of the first tray by a hinge that rotates on a second axis that is perpendicular to the first axis. A first display and a first keyboard affixed to an outer surface of the first tray. A second display and a second keyboard affixed to an outer surface of the second tray.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: A module placement apparatus is provided and includes alignment brackets and a module placement tool. The alignment brackets include first guidance features, define an interior and are disposable aside an array of contacts. The module placement tool is insertible into the interior in first and second stages and includes a frame, a module gripping element operably supported on the frame, second guidance features engageable with the first guidance features at a conclusion of the first stage to maintain a relative orientation of the array of contacts and the frame during the second stage, and a gimbaled handle coupled to the module gripping element to maintain the relative orientation during the first stage until at least first and second guidance feature engagement.

Abstract: Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

Abstract: Apparatuses and methods are provided for preventing removal of an air-moving assembly from a chassis when in operating state. The apparatus includes an interlock assembly having a slide element and one or more interlock elements. The slide element is slideably coupled to the air-moving assembly and resides in a first position when the air-moving assembly is in the operating state, and is slidable to a second position when the air-moving assembly is in a quiesced state. The slide element prevents removal of the air-moving assembly from the chassis in the first position, and allows removal of the air-moving assembly from the chassis in the second position. The interlock element(s) is associated with the slide element and prevents sliding of the slide element from the first position to the second position when the air-moving assembly is in the operating state.

Abstract: A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

Abstract: An apparatus for positioning service element interface devices is provided. A gate is affixed to a computing rack by a gate hinge that rotates on a first axis. A tray is affixed to the gate. The tray has a first side and a second side that are opposite exterior surfaces of the tray. A first display and a first keyboard are affixed to the first side. A second display and a second keyboard are affixed to the second side. The first keyboard and the first display provide a first interface that is redundant with a second interface provided by the second keyboard and the second display.

Abstract: Fabrication of a latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: A system to improve an in-line memory module may include an edging carried by the in-line memory module to stiffen, support, protect, and/or aid in handling the in-line memory module. The system may also include guide ribs carried by the edging to facilitate positioning of the in-line memory module during installation. In one embodiment, the system includes a heat spreader to aid in cooling a plurality of heat sources carried by the in-line memory module. The system may further include a compliant member to regulate the heat spreader's positioning relative to the plurality of heat sources.

Abstract: A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

Abstract: A source of liquid provided an input of liquid into a liquid cooling system. The liquid from the source of liquid flows through a check valve assembly which includes an input, a first output, and a second output. The second output includes a check valve configured to open when the pressure of the liquid exceeds a threshold pressure value. A connector is attached to the first output of the check valve assembly. The connector is a quick connect fitting equipped with a self-sealing valve.

Abstract: A cooling assembly is provided which includes: one or more coolant-cooled heat sinks configured to couple to one or more electronic components to be cooled; one or more flexible coolant conduits; and one or more pivotable coolant manifolds. The flexible coolant conduit(s) couples in fluid communication the pivotable coolant manifold(s) and the coolant-cooled heat sink(s), and accommodates pivoting of the pivotable coolant manifold(s), while maintaining the coolant-cooled heat sink(s) in fluid communication with the pivotable coolant manifold(s). In one or more embodiments, the pivotable coolant manifold(s) pivots between a first position laterally offset from one or more of the coolant-cooled heat sink(s), and a second position above the one or more coolant-cooled heat sinks. First and second pivot arms may be provided at opposite ends of the pivotable coolant manifold(s) to facilitate pivotable movement of the manifold(s) between the first position and the second position.

Abstract: An apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: An electromechanical assembly is provided controlled by voltage across a motor or with an electronic system. The electromechanical assembly includes a control circuit coupled to sense voltage at the motor or within the electronic system, and an electromechanical actuator energized by the voltage sensed by the control circuit. A movable element is movable by the electromechanical actuator from an operational position to a quiesced position when the voltage sensed by the control circuit falls below a quiesced threshold. In certain embodiments, the voltage being sensed is across a motor of an air-moving assembly, which resides within a support structure, or the voltage being sensed is within the electronic system, which resides within the support structure, and the movable element is an interlock element which interlocks to the support structure to prevent removal of one or more components from the structure when sensed voltage is above the quiesced threshold.

Abstract: An electromechanical assembly is provided controlled by voltage across a motor or with an electronic system. The electromechanical assembly includes a control circuit coupled to sense voltage at the motor or within the electronic system, and an electromechanical actuator energized by the voltage sensed by the control circuit. A movable element is movable by the electromechanical actuator from an operational position to a quiesced position when the voltage sensed by the control circuit falls below a quiesced threshold. In certain embodiments, the voltage being sensed is across a motor of an air-moving assembly, which resides within a support structure, or the voltage being sensed is within the electronic system, which resides within the support structure, and the movable element is an interlock element which interlocks to the support structure to prevent removal of one or more components from the structure when sensed voltage is above the quiesced threshold.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.

Abstract: Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a liquid coolant in an operational mode, and drainage of coolant therefrom in a transport mode. The cooling apparatus includes a liquid-cooled heat sink configured to horizontally couple along a main heat transfer surface to the electronic component(s). The heat sink includes a thermally conductive structure with a coolant-carrying compartment through which coolant flows, and a coolant inlet tube and a coolant outlet tube affixed to the thermally conductive structure and in fluid communication with the coolant-carrying compartment to facilitate coolant flow through the compartment. The coolant-carrying compartment has a base surface, and the coolant outlet tube extends into the coolant-carrying compartment towards the base surface to facilitate withdrawal of the liquid coolant from the compartment in the transport mode of the cooling apparatus.