Abstract: A fixture is provided which cleans a plasma etcher of a type that has a holding member with a surface which holds wafers that are to be etched, and an enclosing member which encloses the holding member to form a chamber for the plasma. This fixture operates to produce a large voltage change near the enclosing member and thereby enable the cleaning of the enclosing member by the plasma itself. To achieve such a large voltage change, the fixture is configured to fit inside of the enclosing member, provide a surface which is substantially larger than the surface of the holding member, and make electrical contact with the surface of the holding member. Preferably, the surface provided by the fixture is at least 50% larger than the surface of the holding member.