Abstract: Light-emitting devices (e.g., LEDs) and methods associated with such devices are provided. The devices may include a first pattern and a second pattern which are formed at one or more interfaces of the device (e.g., the emission surface). The patterns may be positioned such that light generated by the device passes through the interfaces of the patterns when being emitted. The patterns can be defined by a series of features (e.g., vias, posts) having certain characteristics (e.g., feature size, depth, periodicity, nearest neighbor distance, etc.) which may be controlled to influence properties of the light emitted from the device, including improving extraction and/or collimation of the emitted light.

Abstract: Thermal management of optical systems including illumination systems is provided. The optical systems may utilize LEDs as a light source. The LEDs may be supported on a heat pipe. The heat pipe facilitates conduction and dissipation of heat generated by the LEDs which may otherwise damage components of the optical system.

Abstract: Thermal management of display systems including LCD systems is provided. The LCD systems may utilize LEDs as a light source. The LEDs may be supported on a heat pipe. The heat pipe facilitates conduction and dissipation of heat generated by the LEDs which may otherwise damage components of the display system.

Abstract: Display systems, such as liquid crystal display systems (LCDs) that include light-emitting diodes (LEDs) as light sources are described. In certain embodiments, high-brightness LEDs are used to illuminate the display system, in combination with thermal management systems and other components described herein. The systems may be designed to use fewer numbers of LEDs for illumination while achieving a brightness comparable to, or exceeding, certain existing display systems of similar size.

Abstract: Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Light-emitting devices (e.g., LEDs) and methods associated with such devices are provided. The devices may include a first pattern and a second pattern which are formed at one or more interfaces of the device (e.g., the emission surface). The patterns may be positioned such that light generated by the device passes through the interfaces of the patterns when being emitted. The patterns can be defined by a series of features (e.g., vias, posts) having certain characteristics (e.g., feature size, depth, periodicity, nearest neighbor distance, etc.) which may be controlled to influence properties of the light emitted from the device, including improving extraction and/or collimation of the emitted light.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: A method for optimizing an LED lighting system cost includes steps of determining LED costs, power source costs, and total costs associated with a plurality of LED quantities, and identifying a lowest total cost as an optimal cost. A LED lighting system includes an LED operated by a constant-current driver at less than its maximum current capacity. A programmable controller including a feedback routine is used to compensate for intensity drift as an LED ages. Other embodiments of LED lighting systems include multiple LEDs producing light having various spectrums to optimize the lighting system efficiency and the effectiveness. A charge controller including an MPPT routine is advantageously employed with a LED lighting system powered by a limited-capacity power source.

Abstract: Light-emitting devices, and related components, processes, systems and methods are disclosed.

Abstract: A method for separating a semiconductor wafer into several thousand devices or dies by laser ablation. Semiconductor wafers are initially pre-processed to create multiple devices, such as blue LEDs, on the wafers. The wafers are then mounted with tape coated with a generally high level adhesive. The mounted wafer is then placed on a vacuum chuck (which is itself positioned on a computer controlled positioning table) to hold it in place during the cutting process. The cutting surface is then covered with a protective layer to prevent contamination from the effluent resulting from the actual cutting process. A laser beam is generated and passed through optical elements and masks to create a pattern, such as a line or multiple lines. The patterned laser projection is directed at the wafer at a substantially normal angle and applied to the wafer until at least a partial cut is achieved through it.