Abstract: A flame retardant polyphenylene sulfide polymeric alloy composition based on polyphenylene sulfide, a polymeric grafting agent (e.g., ethylene/n-butyl acrylate/glycidyl methacrylate terpolymer) and an ethylene copolymer (e.g., ethylene/methacrylic acid ionomer) is provided. At about 35% by weight loading with glass fibers and 13% by weight loading of brominated polystyrene (10%) and antimony oxide (3%), the composition is self extinguishing under UL-94 and retains greater than 3% elongation at break according to ASTM D638.

Abstract: Flame retardant polymer compositions, especially ionomer polymer compositions, are prepared using ethylene diamine phosphate and used as surface coverings and building materials.

Abstract: The low modulus polyimide adhesive compositions of the present invention contain a low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter. The adhesive can be applied upon (or incorporated into) flexible circuits using a relatively low lamination temperature, generally no higher than 200, 190, 180, 175, 170, 165, 160, 155, or 150° C. The adhesive is generally resistant to unwanted curl even in cases where the adhesive polyimide and the base film polyimide have a coefficient of linear thermal expansions (measured between 50° C. and 250° C.) that differ by more than 10, 15, 20 25, or 30 ppm/° C.

Abstract: Flame retardants, and compositions containing the flame retardants are disclosed. The flame retardants are prepared reacting ethylene diamine with polyphosphoric acid; or reacting an ethyleneamine or a mixture of ethyleneamines with phosphoric acid, polyphosphoric acid, pyrophosphoric acid, or a mixtures thereof. A 10% by weight solution of the product in water has a pH between about 3.5 to 6.5. The flame retardants are non-halogen containing flame retardants that do not gas undesirably during processing at temperatures of 235° C. or even higher.