Patents by Inventor Robert Kenneth Leidy
Robert Kenneth Leidy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8881072Abstract: A method of for compensating for variations in structures of an integrated circuit. The method includes (a) selecting a mask design shape and selecting a region of the mask design shape; (b) applying a model-based optical proximity correction to all of the mask design shape; and after (b), (c) applying a rules-based optical proximity correction to the selected region of the mask design shape.Type: GrantFiled: February 5, 2013Date of Patent: November 4, 2014Assignee: International Business Machines CorporationInventors: Santo Credendino, Michael D. Hulvey, Jothimalar Kuppusamy, Robert Kenneth Leidy, Paul William Pastel, Bruce Walter Porth, Anthony K. Stamper
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Patent number: 8647913Abstract: A solid state image sensor, a method for fabricating the solid state image sensor and a design structure for fabricating the solid state image sensor structure include a substrate that in turn includes a photosensitive region. Also included within solid state image sensor is a non-planar reflector layer located over a side of the photosensitive region and the substrate opposite an incoming radiation side of the photosensitive region and the substrate. The non-planar reflector layer is shaped and positioned to reflect uncaptured incident radiation back into the photosensitive region while avoiding optical cross-talk with an additional photosensitive region laterally separated within the substrate.Type: GrantFiled: September 13, 2012Date of Patent: February 11, 2014Assignee: International Business Machines CorporationInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, John J. Ellis-Monaghan
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Patent number: 8458628Abstract: A method of for compensating for variations in structures of an integrated circuit. The method includes (a) selecting a mask design shape and selecting a region of the mask design shape; (b) applying a model-based optical proximity correction to all of the mask design shape; and after (b), (c) applying a rules-based optical proximity correction to the selected region of the mask design shape.Type: GrantFiled: March 6, 2012Date of Patent: June 4, 2013Assignee: International Business Machines CorporationInventors: Santo Credendino, Michael D. Hulvey, Jothimalar Kuppusamy, Robert Kenneth Leidy, Paul William Pastel, Bruce Walter Porth, Anthony K. Stamper
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Publication number: 20130001727Abstract: A solid state image sensor, a method for fabricating the solid state image sensor and a design structure for fabricating the solid state image sensor structure include a substrate that in turn includes a photosensitive region. Also included within solid state image sensor is a non-planar reflector layer located over a side of the photosensitive region and the substrate opposite an incoming radiation side of the photosensitive region and the substrate. The non-planar reflector layer is shaped and positioned to reflect uncaptured incident radiation back into the photosensitive region while avoiding optical cross-talk with an additional photosensitive region laterally separated within the substrate.Type: ApplicationFiled: September 13, 2012Publication date: January 3, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, John J. Ellis-Monaghan
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Patent number: 8299554Abstract: A solid state image sensor, a method for fabricating the solid state image sensor and a design structure for fabricating the solid state image sensor structure include a substrate that in turn includes a photosensitive region. Also included within solid state image sensor is a non-planar reflector layer located over a side of the photosensitive region and the substrate opposite an incoming radiation side of the photosensitive region and the substrate. The non-planar reflector layer is shaped and positioned to reflect uncaptured incident radiation back into the photosensitive region while avoiding optical cross-talk with an additional photosensitive region laterally separated within the substrate.Type: GrantFiled: August 31, 2009Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, John J. Ellis-Monaghan
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Publication number: 20120174046Abstract: A method of for compensating for variations in structures of an integrated circuit. The method includes (a) selecting a mask design shape and selecting a region of the mask design shape; (b) applying a model-based optical proximity correction to all of the mask design shape; and after (b), (c) applying a rules-based optical proximity correction to the selected region of the mask design shape.Type: ApplicationFiled: March 6, 2012Publication date: July 5, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Santo Credendino, Michael D. Hulvey, Jothimalar Kuppusamy, Robert Kenneth Leidy, Paul William Pastel, Bruce Walter Porth, Anthony K. Stamper
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Patent number: 8176446Abstract: A method of for compensating for variations in structures of an integrated circuit. The method includes (a) selecting a mask design shape and selecting a region of the mask design shape; (b) applying a model-based optical proximity correction to all of the mask design shape; and after (b), (c) applying a rules-based optical proximity correction to the selected region of the mask design shape.Type: GrantFiled: September 11, 2008Date of Patent: May 8, 2012Assignee: International Business Machines CorporationInventors: Santo Credendino, Michael D. Hulvey, Jothimalar Kuppusamy, Robert Kenneth Leidy, Paul William Pastel, Bruce Walter Porth, Anthony K. Stamper
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Patent number: 7935604Abstract: A method of forming a small geometry feature. The method includes forming a source layer on a top surface of a substrate; forming a mandrel on a top surface of the source layer, the mandrel having a sidewall; sputtering material from the source layer onto the sidewall of the mandrel to form a sidewall layer on the sidewall of the mandrel; and removing the mandrel. Also methods to forming wires and field effect transistors of integrated circuits.Type: GrantFiled: February 11, 2008Date of Patent: May 3, 2011Assignee: International Business Machines CorporationInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, Walter Victor Lepuschenko, David Alan Meatyard, Stephen A. Mongeon, Richard John Rassel
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Publication number: 20110049330Abstract: A solid state image sensor, a method for fabricating the solid state image sensor and a design structure for fabricating the solid state image sensor structure include a substrate that in turn includes a photosensitive region. Also included within solid state image sensor is a non-planar reflector layer located over a side of the photosensitive region and the substrate opposite an incoming radiation side of the photosensitive region and the substrate. The non-planar reflector layer is shaped and positioned to reflect uncaptured incident radiation back into the photosensitive region while avoiding optical cross-talk with an additional photosensitive region laterally separated within the substrate.Type: ApplicationFiled: August 31, 2009Publication date: March 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, John J. Ellis-Monaghan
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Publication number: 20100279480Abstract: A method of forming a small geometry feature. The method includes forming a source layer on a top surface of a substrate; forming a mandrel on a top surface of the source layer, the mandrel having a sidewall; sputtering material from the source layer onto the sidewall of the mandrel to form a sidewall layer on the sidewall of the mandrel; and removing the mandrel. Also methods to forming wires and field effect transistors of integrated circuits.Type: ApplicationFiled: February 11, 2008Publication date: November 4, 2010Inventors: James William Adkisson, James Peter Gambino, Robert Kenneth Leidy, Walter Victor Lepuschenko, David Alan Meatyard, Stephen A. Mongeon, Richard John Rassel
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Publication number: 20100064273Abstract: A method of for compensating for variations in structures of an integrated circuit. The method includes (a) selecting a mask design shape and selecting a region of the mask design shape; (b) applying a model-based optical proximity correction to all of the mask design shape; and after (b), (c) applying a rules-based optical proximity correction to the selected region of the mask design shape.Type: ApplicationFiled: September 11, 2008Publication date: March 11, 2010Inventors: Santo Credendino, Michael D. Hulvey, Jothimalar Kuppusamy, Robert Kenneth Leidy, Paul William Pastel, Bruce Walter Porth, Anthony K. Stamper
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Patent number: 7524694Abstract: A photo sensing structure and methods for forming the same. The structure includes (a) a semiconductor substrate and (b) a photo collection region on the semiconductor substrate. The structure also includes a funneled light pipe on top of the photo collection region. The funneled light pipe includes (i) a bottom cylindrical portion on top of the photo collection region of the photo collection region, and (ii) a funneled portion which has a tapered shape and is on top and in direct physical contact with the bottom cylindrical portion. The structure further includes a color filter region on top of the funneled light pipe.Type: GrantFiled: December 16, 2005Date of Patent: April 28, 2009Assignee: International Business Machines CorporationInventors: James William Adkisson, Jeffrey Peter Gambino, Robert Kenneth Leidy, Richard John Rassel
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Publication number: 20080261120Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Publication number: 20080261122Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and a top surface; the non-printable region comprising a second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and a top surface; and a capping layer on the sidewalls of the first opaque regions and the sidewalls of the second opaque region.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Publication number: 20080261121Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Patent number: 6180498Abstract: Various alignment targets are disclosed having improved visibility. A first embodiment includes an alignment target having a first reflective layer of a first material such as tungsten having a roughened surface; and a second layer of a second material, such as aluminum, deposited on the first layer. The surface of the second layer is roughened by conforming with the roughened surface of the first layer to provide both layers with a uniform optical layers. The edges of the second layer provides an optical signal to contrast between the two layers for alignment. A second embodiment includes an alignment target with a plurality of parallel elongated trenches; a first material fills each of the trenches; and a patterned layer of a second material is deposited on top the elongated trenches and the insulator layer.Type: GrantFiled: January 8, 1998Date of Patent: January 30, 2001Assignee: International Business Machines CorporationInventors: Robert Michael Geffken, Robert Kenneth Leidy
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Patent number: 5898227Abstract: Various alignment targets are disclosed having improved visibility. A first embodiment includes an alignment target having a first reflective layer of a first material such as tungsten having a roughened surface; and a second layer of a second material, such as aluminum, deposited on the first layer. The surface of the second layer is roughened by conforming with the roughened surface of the first layer to provide both layers with a uniform optical layers. The edges of the second layer provides an optical signal to contrast between the two layers for alignment. A second embodiment includes an alignment target with a plurality of parallel elongated trenches; a first material fills each of the trenches; and a patterned layer of a second material is deposited on top the elongated trenches and the insulator layer.Type: GrantFiled: February 18, 1997Date of Patent: April 27, 1999Assignee: International Business Machines CorporationInventors: Robert Michael Geffken, Robert Kenneth Leidy
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Patent number: 5874318Abstract: According to the preferred embodiment, an erosion and dishing monitor and monitor method are provided that facilitates the accurate optimization of a planarization process as in semiconductor process. The dishing monitor comprises at least two monitor structure sets embedded in a semiconductor substrate, the monitor structure sets comprising a plurality of monitor structures connected together with a plurality of connective conductors. The erosion monitor comprises a plurality of elongated conductors embedded into a semiconductor substrate, the plurality of conductors having varying conductor widths and adjacent substrate widths.Type: GrantFiled: November 13, 1996Date of Patent: February 23, 1999Assignee: Internatioal Business Machines CorporationInventors: Faye Diann Baker, Daniel Shaw Brooks, Robert Kenneth Leidy, Anne Elizabeth McGuire, Rock Nadeau
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Patent number: 5871871Abstract: There is provided, a stabilized multi-layered colored filter structure useful in a digital color camera and method for making same. The method involves effecting reaction between a polyfunctional organosilicon material, such as a hexaorganosilazane with at least one phenolic resist containing an organic dye color forming filter, in a multi-layered structure of color filters on a silicon chip.Type: GrantFiled: September 20, 1996Date of Patent: February 16, 1999Assignee: International Business Machines CorporationInventors: Dennis Pfleegor Hogan, Robert Kenneth Leidy, Harold George Linde
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Patent number: 5804503Abstract: A method and structure for reducing short circuits in semiconductor devices is disclosed. A three layer interlevel dielectric structure is formed over a semiconductor substrate, which typically comprises a first metallization level, M1. The three layer dielectric includes a first insulator layer, a middle spin-on glass (SOG) layer, and a top second insulator layer. The spin-on glass fills defects in the surface of the first insulator layer created during planarization using chemical-mechanical-polishing (CMP). Prior to deposition of the second insulator, a first via is etched through the SOG film and the first insulator layer to expose a portion of the semiconductor substrate, typically a conductive metal. A conductive metal is deposited into the first via and planarized to form a metal interconnection stud. Because the surface defects are filled and covered with the SOG film, none of the deposited metal enters the defects, and short circuits with the stud are greatly reduced.Type: GrantFiled: July 24, 1996Date of Patent: September 8, 1998Assignee: International Business Machines CorporationInventors: Robert Kenneth Leidy, Jeffrey Scott Miller, Jon A. Patrick