Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12) alkyldiol diacrylate (such as bis[3-(4-benzocyclobutenyl)]1,6 hexanediol diacrylate) and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene.

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis [3-(4-benzocyclobutenyl)] 1,n (n=2-12) alkyldiol diacrylate (such as bis [3-(4-benzocyclobutenyl)] 1,6 hexanediol diacrylate) and 1,3 bis 2 [4-benzocyclobutenyl (ethenyl)] benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis [3-(4-benzocyclobutenyl)] 1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2 [4-benzocyclobutenyl(ethenyl)] benzene.

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of styrene or styrene derivative (such as alpha methyl styrene) and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of styrene or styrene derivative and vinylbenzocyclobutene or a vinylbenzocyclobutene derivative.

Abstract: A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is: (a) a copolymer of 5-ethylidene-2-norbornene and vinylbenzocyclobutene (or a vinylbenzocyclobutene derivative); or (b) a copolymer of 5-ethylidene-2-norbornene and 5-(3benzocyclobutylidene)-2-norbornene; or (c) a polymer of 5-(3benzocyclobutylidene)-2-norbornene.

Abstract: An art training device. A graphics scroll presents various images suitable for tracing or copying, or blank spaces for freehand drawing, as it is wound or unwound on spindles. A transparent drawing sheet is mounted lust above the scroll for the user to practice on.

Abstract: There is provided a method of assessing oxidant stress by measuring polymerization of proteins. Also provided is a marker for oxidant stress which includes a polymerized protein. A kit for use in assessing oxidant stress, the kit including an assay for detecting polymerized proteins is also provided. A method of lowering oxidant stress by administering to a patient an effective amount of at least one reducing agent is also provided. A pharmaceutical composition for lowering oxidant stress, the pharmaceutical having an effective amount of reducing agent and a pharmaceutically acceptable carrier is also provided.

Abstract: Prepare a multimodal thermoplastic polymer foam having a distribution of large and small cells in a substantial absence of water by using a blowing agent stabilizer. Multimodal foams of the present invention have blowing agent stabilizer predominantly located proximate to large cells. The resulting multimodal foams have particular utility as thermal insulating materials.

Abstract: The present invention provides a process for preparing a stable dispersion of a preformed polymer in a polyol in a single mixer. A preformed polymer is mixed under sufficient heat and shear to reduce its particle size to a desired size in the presence of a polyol. The present invention also provides stable dispersions of polymers in polyols and polyurethane formulations containing stable dispersions made by the process of the present invention.

Abstract: Prepare a multimodal thermoplastic polymer foam having a distribution of large and small cells in a substantial absence of water by using a blowing agent stabilizer. Multimodal foams of the present invention have blowing agent stabilizer predominantly located proximate to large cells. The resulting multimodal foams have particular utility as thermal insulating materials.

Abstract: The present invention provides a process for preparing a stable dispersion of a preformed polymer in a polyol in a single mixer. A preformed polymer is mixed under sufficient heat and shear to reduce its particle size to a desired size in the presence of a polyol. The present invention also provides stable dispersions of polymers in polyols and polyurethane formulations containing stable dispersions made by the process of the present invention.

Abstract: The invention is a process for the preparation of coated nitride powder, comprising contacting one or more metal complex(es), organo-aluminum material, optionally one or more silicon compounds or mixtures thereof, with nitride powder under conditions such that coated nitride powder is formed. A metal complex is a metal-containing system which is soluble in a host liquid. The process of the invention is a process for making coated nitride powder and obtaining the desirable properties of coated nitride powder, while maintaining the desirable properties of the uncoated powder, such as good thermal conductivity, for use in electronic applications. In another aspect, the invention is a coated nitride powder which has the advantageous properties of the uncoated powder and is a desirable alternative to current nitride coatings.

Abstract: A compound having at least one 2-hydroxy-1,3-propylidene, 2-acetoxy-1,3-propylidene, or 2-alkoxy-1,3-propylidene moiety between two benzocyclobutene end moieties is prepared by (a) contacting a diepoxide species with a benzocyclobutene species containing a functionality capable of reacting with an epoxy group, (b) contacting an epoxy-containing benzocyclobutene species with a species containing two functionalities capable of reacting with an epoxy group, (c) contacting an epoxy-containing benzocyclobutene species with a benzocyclobutene species containing a functionality capable of reacting with an epoxy group, (d) contacting epichlorohydrin with benzocyclobutene species capable of reacting with an epoxy group, or (e) contacting epihalohydrin with benzocyclobutene species and difunctional species, wherein both species contain functionalities capable of reacting with epoxy groups.

Abstract: The invention is a bis-BCB compound of the structure: ##STR1## a method for making same and polymers made therefrom. The novel compounds of this invention are useful in preparing polymers that can form thin film coatings for multichip midules (MCMs) and integrated circuits (ICs). These compounds can be isolated as liquids at room temperature, and can form polymers that are hydrophobic and have low dielectrical and dissipative properties.

Abstract: The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, wherein the bridging member is (a) a direct bond, (b) a polyvalent inorganic radical or (c) a polyvalent organic radical which contains (1) one or more heteroatoms comprising oxygen, sulfur, nitrogen or phosphorus or (2) one or more aromatic radicals, and wherein one or more cyclobutene rings are fused to one of the aryl rings.

Abstract: This invention is directed to a class of arylcyclobutene monomers having the general formula: ##STR1## wherein Ar is aromatic, with the proviso that the carbons of the cyclobutene rings are bonded to adjacent carbon atoms on the same aromatic ring of Ar;and R.sup.1 is a divalent alkyl, cycloaliphatic, aromatic, heteroaromatic, or heterocyclic moiety;polymeric compositions containing these monomers; and articles containing said polymeric compositions.

Abstract: Copolymers of a mono(cyclobutarene) comonomer and a polymaleimide comonomer are described. These copolymers have higher thermal stability and lower water absorption than polymaleimide homopolymers. They are useful in applications such as electronics, membranes, composities, coatings, and adhesives. Examples of such copolymers are those formed from the comonomers 1,1'-(methylenedi-4,1-phenylene)bismaleimide, and 3-(1-(4-methylphenyl)ethenyl)-bicyclo(4.2.0)octa-1,3,5-triene or 3-(2-(4-methylphenyl)ethenyl)-bicyclo(4.2.0)octa-1,3,5-triene.

Abstract: A biscyclobutarene monomer is prepared having two cyclobutarene moieties bridged by a divalent radical having at least one azo linkage. The monomers can be polymerized to form polymers exhibiting outstanding thermooxidative stability at high temperatures for prolonged time periods.

Abstract: Copolymers comprising, in polymerized form, a 1,1-substituted arylethylene comonomer and at least one polymaleimide comonomer, are prepared using a system that provides a reduced onset of polymerization temperature thereby allowing removal of the copolymer from the mold after a preliminary curing period followed by transfer to an oven, a less expensive piece of equipment, for additional curing; thus making the mold, a more expensive piece of equipment, available for the next polymerization run.

Abstract: The invention is a poly(arylcyclobutene) comprising arylcyclobutene moieties connected by a bridging member, wherein the bridging member comprises an amidoalkyl termintated polysiloxane, and wherein one or more cyclobutene rings are fused to one of the aryl rings.