Patents by Inventor Robert Klieber

Robert Klieber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9032797
    Abstract: A sensor device including a mechanical oscillator, an excitation unit which is configured to excite the mechanical oscillator to perform a mechanical oscillation within a non-linear range at a varying excitation frequency, and an evaluation unit configured to detect a jump, arising as a result of anharmonicity, in a resonance oscillation of the mechanical oscillation of the mechanical oscillator.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: May 19, 2015
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Andreas Goehlich, Hoc Khiem Trieu, Robert Klieber, Carole Jonville
  • Publication number: 20120210794
    Abstract: A sensor device including a mechanical oscillator, an excitation unit which is configured to excite the mechanical oscillator to perform a mechanical oscillation within a non-linear range at a varying excitation frequency, and an evaluation unit configured to detect a jump, arising as a result of anharmonicity, in a resonance oscillation of the mechanical oscillation of the mechanical oscillator.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 23, 2012
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Andreas GOEHLICH, Hoc Khiem TRIEU, Robert KLIEBER, Carole JONVILLE
  • Publication number: 20110278742
    Abstract: A circuitry comprises a substrate with a terminal region, a semiconductor device with a contact terminal, a bond wire connecting the terminal region to the contact terminal and a solder glass encapsulating material. The solder glass encapsulating material is mounted on the semiconductor device with the bond wire, so that at least the bond wire is hermetically enclosed. The substrate has a substrate material with a first coefficient of thermal expansion, the semiconductor device has a device material with a second coefficient of thermal expansion and the bond wire has a bond wire material with a third coefficient of thermal expansion. The solder glass encapsulating material has a coefficient of thermal expansion adjusted to a predefined value with regard to the second and third coefficients of thermal expansion.
    Type: Application
    Filed: August 7, 2008
    Publication date: November 17, 2011
    Inventors: Burkhard Schelle, Robert Klieber
  • Patent number: 8011250
    Abstract: An apparatus including a chamber having a chamber opening, a plunger which is movable within the chamber so as to change a chamber volume, which is defined by the plunger and a chamber wall and which adjoins the chamber opening, includes a measurer for measuring a pressure within the chamber or for measuring a force F, F being the force which acts upon the plunger so as to change the chamber volume.
    Type: Grant
    Filed: December 22, 2006
    Date of Patent: September 6, 2011
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.v.
    Inventors: Hoc Khiem Trieu, Peter Wiebe, Robert Klieber
  • Publication number: 20100089167
    Abstract: An apparatus including a chamber having a chamber opening, a plunger which is movable within the chamber so as to change a chamber volume, which is defined by the plunger and a chamber wall and which adjoins the chamber opening, includes a measurer for measuring a pressure within the chamber or for measuring a force F, F being the force which acts upon the plunger so as to change the chamber volume.
    Type: Application
    Filed: December 22, 2006
    Publication date: April 15, 2010
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Hoc Khiem Trieu, Peter Wiebe, Robert Klieber
  • Publication number: 20090302190
    Abstract: A chip holder for holding a fluidic chip and for providing a fluid connection thereto has a guide adapted such that the fluidic chip can be slid into the chip holder in a guiding direction. The chip holder further has a fastener adapted to press a fluidic connection toward the fluidic chip, such that the fluidic chip is fixed within the chip holder. The guide and the fastener are adapted such that the guiding direction and the direction in which the fluidic connection is pressed exhibit an angle in the range between 45° and 135°, including 45° and 135°. A fluidic system has a chip holder and a fluidic chip inserted therein. A chip holder system has a chip holder and an extension module attached thereto such that the extension module is in contact with the fluidic chip, when the fluidic chip is inserted in the chip holder.
    Type: Application
    Filed: October 25, 2006
    Publication date: December 10, 2009
    Applicants: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V., NIJMEGEN UNIVERSITY
    Inventors: Hoc Khiem Trieu, Johann Slotkowski, Robert Klieber, Jan Cornelis Maria Van Hest, Kaspar Koch, Floris Petrus Johannes Theodorus Rutjes, Pieter Nieuwland, Peter Wiebke