Abstract: The invention relates to a transport member for transporting plate-shaped substrates which are to be electrolytically galvanized in a bath, comprising a carrier belt with first contact members fastened thereto which each have a first contact portion that contacts a first side of a substrate under prestress and with electrical conduction in an active position and that is clear of the substrate in an inactive position. The transport member further comprises second contact members which each have a second contact portion that in an active position conductively contacts a second side of the same substrate under prestress and that in an inactive position lies free from said substrate, while the transport member further comprises blocking means for blocking the first contact members and the second contact members in the inactive positions thereof during the electrolytic galvanizing process.

Abstract: The invention relates to a method and a device for bonding solder balls to connecting points which are provided on a substrate in a predetermined pattern. The solder balls are placed into holes provided in a plate-shaped element, which holes are each capable of accommodating one solder ball, and which are provided in the plate-shaped element in a pattern which corresponds with the pattern of the connecting points on the substrate. A combination of at least one substrate and a plate-shaped element containing solder balls is passed, by means of a conveying element, through a housing in which the solder balls are subjected to a heat treatment. The combinations, which each consist of at least one plate-shaped element and at least one substrate, are passed through the housing by the conveying element via lock mechanisms disposed near an inlet and near an outlet of the housing. Inside the housing the solder balls are placed into the holes provided in the plate-shaped element.