Abstract: In an embodiment a device includes a thermoelectric component, an electrode arranged opposite the thermoelectric component and a high voltage source configured to generate a high voltage between the thermoelectric component and the electrode sufficient to ignite a dielectric barrier discharge.

Abstract: An apparatus for generating a plasma above a treatment object. The apparatus includes a plasma-generating element such that during operation the plasma is generated by the plasma-generating element. The apparatus further includes a sealing element attached to the plasma-generating element. The sealing element has a cavity and is configured to form a closed volume with a part of the treatment object, so that at least a part of the cavity is part of the closed volume and, during operation of the apparatus, the plasma is generated in the closed volume. The sealing element includes a reception region that is configured so that a part of the treatment object can be inserted into the reception region. A method is also disclosed for performing a plasma treatment to a treatment object using the apparatus.

Abstract: A method of operating a piezoelectric plasma generator including applying an input signal to a piezoelectric transformer of the piezoelectric plasma generator. An absolute value of a peak amplitude of the input signal is periodically reduced and increased to a level smaller and larger than an ignition voltage of the plasma generator, such that plasma generation periodically collapses.

Abstract: The invention relates to a device comprising an electroceramic component (1) having a first area (2) and a second area (3), a potting compound (11) at least partially surrounding the electroceramic component (1), and a sleeve-shaped housing (15) which at least partially surrounds the potting compound (11), the housing (15) having, in a first housing section (15a) which surrounds the potting compound (11) in the first area of the electroceramic component (1), a material wherein the thermal conductivity of said material is greater than the thermal conductivity of a material of the housing (15) in a second housing section (15b), and wherein the housing (15) in the second housing section (15b) surrounding the potting compound (11) in the second area of the electroceramic component (1) comprises a non-conductive material.

Abstract: Methods for producing ceramic multi-layer components and multi-layer components made by such methods. A method includes the following steps: providing green layers for the ceramic multi-layer components, stacking the green layers into a stack and subsequently pressing the stack into a block, singulating the block into partial blocks each having a longitudinal direction, thermally treating the partial blocks and subsequently machining surfaces of the partial blocks. Recesses are produced on the surfaces of the partial blocks during the machining, and the partial blocks are singulated.

Abstract: A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

Abstract: A multi-layer component (1) is specified, comprising a main body (2) with an external contact (3) arranged thereon, a further contact (5) for electrically contacting the multi-layer component (1), and a connecting element (4) for connecting the external contact (3) and the further contact (5), wherein the connecting element (4) is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact (5) from the external contact (3) is brought about.

Abstract: The present application relates to a method for producing ceramic multi-layer components (100), comprising the following steps: providing green layers (5) for the ceramic multi-layer components (100), stacking the green layers (5) into a stack and subsequently pressing the stack into a block (1), singulating the block (1) into partial blocks (3) each having a longitudinal direction (X), thermally treating the partial blocks (3) and subsequently machining surfaces of the partial blocks (3), wherein recesses (11) are produced on the surfaces of the partial blocks (3) during the machining, and singulating the partial blocks (3). The application further relates to a multi-layer component.

Abstract: An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.

Abstract: A method can be used for producing ceramic multilayer components. The method includes providing green layers for the ceramic multilayer components, stacking the green layers into a stack, and subsequently compressing the stack to form a block. Furthermore, the method includes isolating the block into partial blocks that each have a longitudinal direction, thermally treating the partial blocks, subsequently mechanically machining surfaces of the partial blocks, and providing the partial blocks with outer electrodes and isolating the partial blocks in each case transversely to the longitudinal direction into individual ceramic multilayer components.

Abstract: A multi-layer component (1) is specified, comprising a main body (2) with an external contact (3) arranged thereon, a further contact (5) for electrically contacting the multi-layer component (1), and a connecting element (4) for connecting the external contact (3) and the further contact (5), wherein the connecting element (4) is embodied in such a way that a decoupling of mechanical stresses that occur in the further contact (5) from the external contact (3) is brought about.

Abstract: An electrical component includes at least one external contact having a first metallization and a second metallization. The metallizations are fired and the second metallization only partly covers the first metallization. Furthermore, an electrical component includes at least one frame-shaped metallization. Furthermore, an electrical component includes a first and second metallization that have a different wettability with solder material.

Abstract: An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.

Abstract: An electrical component having multiple layers includes dielectric layers that are stacked to form a main body, electrodes positioned at intervals between at least some of the dielectric layers, and at least two bumps configured to act as electrical contacts for the electrical component. The bumps are on a surface of the main body. The electrical component also includes contacts in the main body that electrically connect bumps and electrodes. The electrodes define first and second electrode stacks, each of which contacts one of the bumps.

Abstract: An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.

Abstract: A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.

Abstract: A method produces a component having a ceramic base body and contact surfaces on opposite sides of the ceramic base body. The method includes forming first protective layers on the opposite sides of the ceramic base body in regions not to be covered by the contact surfaces, forming second protective layers on opposite surfaces of the ceramic base body, sintering the ceramic base body with the first and second protective layers at a first temperature, forming the contact surfaces on the ceramic base body, and sintering the contact surfaces at a temperature that is lower than the first temperature.

Abstract: An electrical component includes a base having at least a first ceramic section and a second ceramic section. The first ceramic section and the second ceramic section include different materials, which have resistances with negative temperature coefficients. The component also includes first and second contact layers on the base. The first and second ceramic sections are between the first and second contact layers. A plurality of stacks of electrically conductive electrode layers are arranged inside the base. Stacks of electrode layers are electrically connected to the first and second contact layers.

Abstract: An electrical multilayer component (1) is suggested which has a main body (5) constructed from stacked dielectric layers. Electrode areas, in which electrodes (10A, 15A) are realized, are arranged at intervals between the dielectric layers. These electrodes (10A, 15A) are contacted in an electrically conductive way by at least two bumps (10, 15) for the electrical contact of the component. A component of this type displays an especially high integration density of passive components and may be mounted especially simply on a substrate using flip chip construction.

Abstract: An electrical component includes a ceramic base body having at least four contact surfaces. Two of the contact surfaces are on opposite sides of the ceramic base body. First protective layers are arranged on regions of the opposite sides of the ceramic base body that do not include the contact surfaces. The first protective layers have a composition that allows the first protective layers to be sintered at a higher temperature than the contact surfaces. Second protective layers are arranged on at least two opposite surfaces of the ceramic base body. The ceramic base body, the first protective layers, and the second protective layers are sintered together.