Abstract: A computer specifies a substrate comprising a first side opposite a second side. The computer specifies a first plurality of flexible pins protruding from the first side of the substrate, the first plurality of pins for installing in a first plurality of pad connectors of a pinless socket. The computer specifies a second plurality of flexible pins protruding from the second side of the substrate, the second plurality of pins for installing in a second plurality of pad connectors of a pinless integrated circuit component, wherein the first selection of flexible pins are for electrical connection to the second plurality of flexible pins through the substrate to provide electrical contact points between the pinless socket and the pinless integrated circuit component.

Abstract: A dual-sided connector pin interposer includes a substrate comprising a first side opposite a second side. The interposer includes a first plurality of flexible pins protruding from the first side of the substrate. The first plurality of flexible pins is positioned for installation in a first plurality of pad connectors of the pinless socket. The interposer includes a second plurality of flexible pins protruding from the second side of the substrate. The second plurality of flexible pins is positioned for installation in a second plurality of pad connectors of the pinless integrated circuit component. The first plurality of flexible pins are electrically connected to the second plurality of flexible pins through the substrate to provide electrical contact points between the pinless socket and the pinless integrated circuit component when the interposer is installed.