Patents by Inventor Robert L. Beckman

Robert L. Beckman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of a multilayer conductive pattern on a dielectric substrate
    Patent number: 4774127
    Abstract: A pattern of conductive material is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material having a layer of dimensionally-stable material adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.
    Type: Grant
    Filed: June 15, 1987
    Date of Patent: September 27, 1988
    Assignee: Tektronix, Inc.
    Inventors: John J. Reagan, Peggy J. Parks, Nancy L. Miller, Robert L. Beckman
  • Polyimide embedded conductor process
    Patent number: 4650545
    Abstract: A polyimide embedded conductor process assures adherence of a metal conductor to a polyimide layer and allows closer spacing between conductors. The conductor is laid on a sacrificial substrate, and then the polyimide layer is laid over the conductor and substrate. The substrate is etched away to expose the conductor, and the polyimide layer may be etched away from the conductor to form attachment tabs.
    Type: Grant
    Filed: February 19, 1985
    Date of Patent: March 17, 1987
    Assignee: Tektronix, Inc.
    Inventors: Carl W. Laakso, John J. Reagan, Robert L. Beckman