Abstract: A retractable enclosure for moveable areas such as barges or trucks and for stationary areas such as swimming pools and areas which must be covered at one time and open at another time such as those housing telescopes, cranes, reactors, etc. The enclosure comprises a multiplicity of rail moveable frames having fabric covered peripheries and constructed to allow the frames to be moved close together at one time whereby the area is uncovered, and to be moved apart or extended to the extent allowed by the attached fabric, whereby the area is covered. A pair of parallel rails is positioned one on each side of the area to be covered. Each frame is supported by a pair of multi-axis trolleys, one trolley positioned at each frame end and engaging one of the rail pair, thereby allowing the frame to move readily.

Abstract: An earthquake detector motion sensitive device capable of detecting any one or more of the conditions of angular tilt, vibration or acceleration having an electrically conductive pendulum with a main mass located next to its suspension point and having an extension arm that extends below the main mass. When the pendulum suspension point is acted upon by an outside force of vertical or lateral motion, the extension arms lower end will travel farther than the distance that the main mass travels, causing the lower end of the pendulum extension arm to mechanically amplify the movement of the main mass. At the lower end of the extension arm is an upper switch contact which is suspended into the opening of a lower switch contact. During seismic activity the two switch contacts will be caused to touch each other which will activate an audio signaling device and charge an electrolytic capacitor.

Abstract: A method including a novel bath is described for the nickeling of the aluminum pads of a chip, when either in die form or in wafer assembly. A near-neutral pH immersion zinc bath is used to cover the aluminum with zinc, which is followed by immersion in an electroless boron-nickel solution for nickeling of the zinc. The method eliminates the need to isolate the chip silicon from the plating bath.

Abstract: A method of selectively nickeling a layer of polymerized polyester resin is described. Patterns of electrically conducting nickel are produced on the resin surface by etching the surface of the resin prior to covering the etched surface with a patterned layer of unetched resin which exposes the etched resin in the regions in which metallization is to occur. A palladium plating solution followed by an immersion boron-nickel bath provide the metalization on the etched regions of the resin.

Abstract: A process for electrically interconnecting a group of integrated-circuit chips embedded in plastic is described. Multilayer conductors are plated in grooves photoformed in successively applied plastic layers and connected to the chip pads and to conductors on other layers through vias also photoformed in the plastic. Photoformation of wiring grooves and layer-interconnecting vias is accomplished by ultraviolet irradiation of photosensitized liquid polyester resin.