Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.

Abstract: An electronic device includes a housing and a water tight display disposed within the housing. The display may include a light guide and a gasket coupled to at least a portion of the light guide. A cavity may be interposed between the gasket and the light guide. A flexible printed circuit assembly (FPCA) may couple to the light guide and the gasket to seal an opening of the cavity. Light sources may be connected to the flexible printed circuit assembly and disposed within the cavity. Adhesive tape may couple to the light guide and the gasket on a side opposite the FPCA to seal an opening of the cavity. Collectively, the light guide, the gasket, the flexible printed circuit assembly, and the adhesive tape may prevent water from reaching the cavity.

Abstract: An electronic device includes a housing and a water tight display disposed within the housing. The display may include a light guide and a gasket coupled to at least a portion of the light guide. A cavity may be interposed between the gasket and the light guide. A flexible printed circuit assembly (FPCA) may couple to the light guide and the gasket to seal an opening of the cavity. Light sources may be connected to the flexible printed circuit assembly and disposed within the cavity. Adhesive tape may couple to the light guide and the gasket on a side opposite the FPCA to seal an opening of the cavity. Collectively, the light guide, the gasket, the flexible printed circuit assembly, and the adhesive tape may prevent water from reaching the cavity.

Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.

Abstract: An electronic device includes a stack assembly. The stack assembly is provided with a stack of sub-assemblies such as a display for rendering content, front lighting layered on top of the display for illuminating the display, a capacitive touch sensor layered on top of the front lighting for detecting touch inputs, and a cover glass layered on top of the capacitive touch sensor. Each sub-assembly is adhered to another sub-assembly with a film optically clear adhesive before coupling sub-assemblies with each other, which forms a touch-sensitive front-lit display that is capable of accepting user input and rendering content in low ambient light conditions.

Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.

Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electrophoretic display sub-assembly for rendering content, a front light sub-assembly comprising a light guide, a light FPC, and a plurality of light sources, and a capacitive touch sensing sub-assembly for detecting touch inputs. A yellow-pigmented tape is applied over the light sources and an edge of the light guide. A stiffener member is coupled to the light FPC opposite the yellow-pigmented tape.

Abstract: Technologies are described herein for photobleaching a display. A display may be photobleached by exposing the display to light emitted by an external lamp and/or may be photobleached using one or more display lights of the electronic device during a burn-in period. In some examples, the light emitted by the lamp is filtered to remove wavelengths below a certain wavelength. The light that is received by the display from the lamp may include wavelengths between about 310 nm and 700 nm. These wavelengths correspond to visible light and near-visible light. The display may be exposed to the light for some duration or until some dose of light is received by the display. In other configurations, a burn-in period is performed for about eighteen hours.

Abstract: An electronic device includes a stack assembly. The stack assembly is provided with a stack of sub-assemblies such as a display for rendering content, front lighting layered on top of the display for illuminating the display, a capacitive touch sensor layered on top of the front lighting for detecting touch inputs, and a cover glass layered on top of the capacitive touch sensor. Each sub-assembly is adhered to another sub-assembly with a film optically clear adhesive before coupling sub-assemblies with each other, which forms a touch-sensitive front-lit display that is capable of accepting user input and rendering content in low ambient light conditions.

Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electronic paper display sub-assembly for rendering content, a front light sub-assembly for illuminating the electronic display sub-assembly, and a capacitive touch sensing sub-assembly for detecting touch inputs. The cover glass includes two apertures for the placement of control buttons for the electronic device. Prior to assembly of the electronic device, the cover glass is strengthened after the two apertures are formed so as to strengthen the interior edges of the apertures.

Abstract: An electronic device includes a stack assembly and a cover glass. The stack assembly includes an electronic paper display sub-assembly for rendering content, a front light sub-assembly for illuminating the electronic display sub-assembly, and a capacitive touch sensing sub-assembly for detecting touch inputs. The cover glass includes two apertures for the placement of control buttons for the electronic device. Prior to assembly of the electronic device, the cover glass is strengthened after the two apertures are formed so as to strengthen the interior edges of the apertures.

Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.

Abstract: A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.

Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.

Abstract: The present invention is an ultra-thin circuit package with a thinned electronic device having a thickness of less than about 100 &mgr;m; a flexible circuit substrate; and an adhesive layer with a thickness of less than about 25 &mgr;m between the electronic device and the circuit substrate. The circuit package is less than about 275 &mgr;m thick. In another embodiment, the circuit packages may be stacked on one another and laminated together to create an extremely high-density three-dimensional electronic circuit package.