Patents by Inventor Robert L. Decker

Robert L. Decker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Article comprising molded circuit
    Patent number: 6110576
    Abstract: An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.
    Type: Grant
    Filed: October 16, 1998
    Date of Patent: August 29, 2000
    Assignee: Lucent Technologies Inc.
    Inventors: Robert L. Decker, John D. Weld