Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.

Abstract: There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.

Abstract: An apparatus for inserting integrated circuit packages into sockets on a burn-in board includes a plurality of loader heads, one for each column of sockets on the board, for pushing the packages into the sockets; a plurality of support means, one for each loader head, for aligning and supporting the package under the loader head; and a plurality of channels, one for each loader head, for delivering IC packages to the support means. Movement of the loader head in the downward direction clamps the IC package between the loader head and the support means for insertion of the package into the socket.