Abstract: Semiconductor packages and methods for forming semiconductor packages are disclosed. An example semiconductor package includes a substrate and a core. An insulator material is present over the core, and along a direction perpendicular to a first surface of the core, a portion of the insulator material is between the core and a first surface of the substrate. A via extends between the first surface of the core and a second surface of the core in the direction perpendicular to the first surface of the core. A bridge die is in a recess in the substrate. The bridge die is coupled with the via. An electronic component is coupled to an end of the via at a second surface of the substrate.

Abstract: A portable, self-contained stove includes (i) a container; and (ii) an adjustable cooking platform which selectively fits into storage and cooking positions with respect to the container. The cooking platform is compressible and extendible and is selectively placed within the container, thereby avoiding the loss of the platform and conserving space within the container.

Abstract: A portable, self-contained stove system includes (i) a container; and (ii) a platform which selectively fits into storage and cooking positions with respect to the container. The platform is configured to be selectively mounted on a container and to selectively support a cooking surface thereon. Platforms are disclosed which are specially designed to separate the flow path of fire out of the container from that of oxygen flowing into the container. Platforms are also disclosed which are adjustable such that they can be selectively disposed within a container before and/or after use.