Patents by Inventor Robert L. Olivier

Robert L. Olivier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Efficient multiple power and ground distribution of SMT IC packages
    Patent number: 6707145
    Abstract: An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: March 16, 2004
    Assignee: Intel Corporation
    Inventors: Steven L. Pollock, Robert L. Olivier
  • Integrated circuit package with EMI shield
    Patent number: 6479886
    Abstract: An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a ground pin is electrically coupled to the semiconductor die, a ferrite bead is electrically coupled to the EMI shield and the ground pin, and a package body encapsulates the EMI shield.
    Type: Grant
    Filed: September 15, 2000
    Date of Patent: November 12, 2002
    Assignee: Intel Corporation
    Inventors: Steven L. Pollock, Robert L. Olivier
  • Efficient multiple power and ground distribution of SMT IC packages
    Publication number: 20020084533
    Abstract: An apparatus, comprising a substrate having a surface, comprising an array of electrical contacts, and a plurality of electrical planes, where the plurality of electrical planes are positioned within the electrical contact array.
    Type: Application
    Filed: December 29, 2000
    Publication date: July 4, 2002
    Inventors: Steven L. Pollock, Robert L. Olivier
  • Integrated circuit package with EMI shield
    Patent number: 6365960
    Abstract: An improved packaged IC is disclosed, which includes a semiconductor die mounted to a substrate and an EMI shield that encapsulates the semiconductor die. In addition, a package body encapsulates the EMI shield.
    Type: Grant
    Filed: June 19, 2000
    Date of Patent: April 2, 2002
    Assignee: Intel Corporation
    Inventors: Steven L. Pollock, Robert L. Olivier