Patents by Inventor Robert L. Otwell

Robert L. Otwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cost effective modular-linear wafer processing
    Publication number: 20010051082
    Abstract: An inventive module and fabrication system for processing semiconductor devices reduces the overall cost per unit processed, by eliminating the need for expensive rotational robots. The modules and fabrication system are configured so that wafer handlers are required to travel only along linear paths. The inventive modules may include an integral conveyor or may couple a remote conveyor. Preferably, the conveyor is positioned normal to the wafer handler's transport path in order to achieve the most compact footprint.
    Type: Application
    Filed: March 27, 2001
    Publication date: December 13, 2001
    Inventors: Thomas I. Kirkpatrick, Robert L. Otwell
  • Cost effective modular-linear wafer processing
    Patent number: 6238161
    Abstract: An inventive module and fabrication system for processing semiconductor devices reduces the overall cost per unit processed, by eliminating the need for expensive rotational robots. The modules and fabrication system are configured so that wafer handlers are required to travel only along linear paths. The inventive modules may include an integral conveyor or may couple a remote conveyor. Preferably, the conveyor is positioned normal to the wafer handler's transport path in order to achieve the most compact footprint.
    Type: Grant
    Filed: March 27, 2000
    Date of Patent: May 29, 2001
    Assignee: Applied Materials, Inc.
    Inventors: Thomas I. Kirkpatrick, Robert L. Otwell
  • Cost effective modular-linear wafer processing
    Patent number: 6053687
    Abstract: An inventive module and fabrication system for processing semiconductor devices reduces the overall cost per unit processed, by eliminating the need for expensive rotational robots. The modules and fabrication system are configured so that wafer handlers are required to travel only along linear paths. The inventive modules may include an integral conveyor or may couple a remote conveyor. Preferably, the conveyor is positioned normal to the wafer handler's transport path in order to achieve the most compact footprint.
    Type: Grant
    Filed: September 5, 1997
    Date of Patent: April 25, 2000
    Assignee: Applied Materials, Inc.
    Inventors: Thomas I. Kirkpatrick, Robert L. Otwell