Abstract: A resistor network for terminating active electronic circuits such as stub series terminated logic and emitter coupled logic circuits. The network has a substrate with top and bottom surfaces and a common via extending through the substrate. Several resistor pairs are located on the first surface surrounding the common via. Each resistor pair has first and second vias. Resistors are connected between the first and second vias. Several solder spheres are located on the bottom surface. Each of the solder spheres are electrically connected to one of the first, second or common vias.

Abstract: A wave transmission line terminator having application in computer data buss termination, single and multiple channel analog transmission line termination and other similar terminations uses thick film components including resistors and capacitors in combination with a ball grid array termination. The thick film resistors are placed on a first side of a substrate opposite the capacitors and ball grid array, and are electrically connected thereto by electrically conductive vias in the substrate. Several different configurations are disclosed which make the terminator more suitable for specific application.

Abstract: A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.