Abstract: A cleaning apparatus having a container for holding a quantity of cleaning agent, which is vaporized and condensed to form an upper vapor layer. Essentially, the container is divided into a lower chamber, for holding the cleaning agent, and an upper chamber for containing the vapors. One or more heat pumps are adapted to establish a relatively low temperature in the upper region to condense the vapors released by the lower heating process. Multiple high thermally conductive shunting devices are coupled between the high temperature end of the heat pumps and the bottom portion of the container to transfer extracted heat from the upper portion to the lower portion, to augment the vaporization process.

Abstract: Disclosed is a system comprising a plurality of networks, encapsulated in substantially electrically non-conductive materials and positioned interior to the outer surface of an encasement region. According to the invention, at least one outer surface of at least one of the encapsulated networks is complementary to, adjacent to, and in physical contact with at least one outer surface of at least one other of the encapsulated networks. Also disclosed is a method for constructing the system. In a preferred embodiment, the system is a toroidally shaped power supply whose modular structure facilitates ease of testing and assembly, affords considerable space savings, substantially reduces manufacturing waste costs, and eliminates a proven source of circuit failure.

Abstract: Disclosed is a component carrier adapted for mounting components on curved surfaces. The carrier comprises a rigid base member having a top surface adapted for supporting a component and a bottom surface curved to mount flush to a complementary curved support surface.