Patents by Inventor Robert Lake Hang Lam

Robert Lake Hang Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic surface mount package
    Patent number: 5656985
    Abstract: An electronic surface mount package provides a one piece construction package (with an open bottom) with one or more terminal pins molded into the package. Each of the pins have a notched post upon which a wire is wound which is from a toroid transformer carried within the package. Each of the posts are notched so their respective wires are separate from one another so as to prevent arcing. The case is opened at the bottom which prevents harm from expansion or cracking.
    Type: Grant
    Filed: August 10, 1995
    Date of Patent: August 12, 1997
    Assignee: Halo Electronics, Inc.
    Inventors: Peter Lu, Jeffrey Heaton, James W. Heaton, Peter Loh Hong Pao, Robert Lake Hang Lam, Tsang Kei Sun