Abstract: The present invention is directed to a method for diagnosing cancer, the method comprising: (a) comparing a concentration of one or more metabolite(s) present in a sample obtained from a subject with the concentration of the same one or more metabolite(s) in a reference standard, wherein the one or more metabolite(s) are selected from: a lipoprotein, myo-inositol, glucose, ?-hydroxybutyrate, ?-hydroxybutyric acid, an N-acetylated glycoprotein (NAC), threonine, lactate, lactic acid, acetate, and acetic acid; and (b) diagnosing cancer when: (i) the concentration of one or more metabolite(s) selected from: myo-inositol glucose, ?-hydroxybutyrate, ?-hydroxybutyric acid, NAC, and threonine is higher in the sample relative to the reference standard, wherein the reference standard is a non-cancer reference standard; and/or (ii) the concentration of one or more metabolite(s) selected from: a lipoprotein, lactate, lactic acid, acetate, and acetic acid is lower in the sample relative to the reference standard, wherein

Abstract: In an example, a method for forming a composite part includes, based on a part specification, cutting layers of material in a sequence and positioning the layers to form a stack. For each layer, after positioning the layer and before cutting a next layer in the sequence, the method includes (i) scanning along a length of the layer to determine an image, (ii) determining, based on the image, at least two edges of the layer, (iii) determining, based on the edges, a measured width at locations along the length of the layer, (iv) comparing the measured width at each location to a target width at the location, (v) deciding, based on the comparison, whether to adjust the production process, and (vi) if the decision is to adjust the production process, then adjusting the production process based on the comparison. The part specification specifies the target width at each location.

Abstract: In an example, a method for forming a composite part includes, based on a part specification, cutting layers of material in a sequence and positioning the layers to form a stack. For each layer, after positioning the layer and before cutting a next layer in the sequence, the method includes (i) scanning along a length of the layer to determine an image, (ii) determining, based on the image, at least two edges of the layer, (iii) determining, based on the edges, a measured width at locations along the length of the layer, (iv) comparing the measured width at each location to a target width at the location, (v) deciding, based on the comparison, whether to adjust the production process, and (vi) if the decision is to adjust the production process, then adjusting the production process based on the comparison. The part specification specifies the target width at each location.

Abstract: A method for hydrating yeast comprises several steps. A package comprising a thermochromic ink and an indicator is provided. A liquid is provided. The temperature of the liquid is measured by placing the package in contact with the liquid. The liquid is heated or cooled until the thermochromic ink indicates the liquid is within the predetermined temperature range. The liquid and yeast are combined. The package comprises a pouch, a thermochromic ink, and an indicator. The pouch is formed from one or more films sealed together to create an internal space. The thermochromic ink and indicator are arranged relative to each other to indicate when the liquid is within a predetermined temperature range. The thermochromic ink changes color when the liquid is within the predetermined temperature range.

Abstract: A thermal attach and detach method and system for surface-mounted components (SMCs) employs a planar-heater which generates heat in response to an electrical current. The heater's resistance varies with its temperature, and the resistance is read to determine heater and SMC temperature. A means of gripping an SMC is provided such that the device's I/O contacts are heated by thermal conduction from the planar-heater through and/or along the SMC's side-walls. An electrical current is provided to the planar-heater such that heat sufficient to attach/detach the I/O contacts to or from a PCB is generated. The method enables the gripping, heating, resistance monitoring and SMC temperature measuring to occur simultaneously. Several means of gripping an SMC are described, including vacuum, mechanical, adhesive and magnetic. A method which employs a heating element to heat a substrate on which SMCs may be mounted is also described.

Abstract: An event processing system performs quickly processing of events in a communication network. The system comprises a client process that controls the sequencing of event processing, a plurality of servers that process the events with the help of a shared object library and a dispatcher that selects an available server so that no two servers process events from the same event queue at any given time. The client time-stamps the events and organizes them into event queues per node, using a node identification. An outstanding queue tracks the current events being processed for a node based on a message ID that is returned by the dispatcher when an event is sent to a server. Also, an overflow queue tracks the sequence of nodes to be serviced after a maximum outstanding limit of events being processed at a given time has been reached.