Patents by Inventor Robert Lee Eisenhart

Robert Lee Eisenhart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10818997
    Abstract: A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: October 27, 2020
    Assignee: VUBIQ NETWORKS, INC.
    Inventors: Michael Gregory Pettus, Robert Lee Eisenhart
  • Publication number: 20190207283
    Abstract: A printed circuit board assembly comprising a plurality of layers. At least one of the plurality of layers is formed of a dielectric material and has an extended portion extending beyond the other layers in the plurality of layers. A first metallic layer is located on at least a portion of the extended portion of the dielectric layer. The first metallic layer and the dielectric layer are configured to form a launch transducer comprising one or more transmission lines and a transducer element coupled to the one or more transmission lines. The transducer element is configured to propagate millimeter wave frequency signals.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: Michael Gregory Pettus, Robert Lee Eisenhart