Abstract: Optically transparent fiber glass cover substrates for electronic displays. The cover substrates include an optically transparent fiberglass composite layer including a fiberglass layer embedded in a matrix material and an optically transparent hard-coat layer bonded to a top surface of the optically transparent fiberglass composite layer. A bottom surface of the optically transparent fiberglass composite layer may define a bottommost exterior surface of a cover substrate. The bottommost exterior surface of a cover substrate may be disposed over a display surface of an electronic display to protect the display surface from damage.

Abstract: A cover element for an electronic device that includes a glass element having a thickness from 20 ?m to 125 ?m, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.

Abstract: A cover element for an electronic device that includes a redrawn glass element, first and second primary surfaces, and a polymeric layer disposed over the first primary surface. The redrawn glass element has a reduced thickness and an average surface roughness of 1 nanometer or less. Further, the cover element can withstand a pen drop height of greater than 6 centimeters or 2.5 times or more than that of a control pen drop height of the cover element having a non-redrawn glass element the layer according to Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A flexible glass laminate structure includes a flexible glass substrate having a thickness of no more than 0.3 mm. The flexible glass laminate structure includes a flexible glass layer including the flexible glass substrate. A property control layer is laminated to the flexible glass layer. A neutral axis of the flexible glass laminate is located outside the flexible glass layer when the flexible glass layer is in a compressive bend configuration.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress ?I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress ?B at the first primary surface in tension, ?I+?B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

Abstract: A flexible glass laminate structure includes a flexible glass substrate having a thickness of no more than 0.3 mm. The flexible glass laminate structure includes a flexible glass layer including the flexible glass substrate. A property control layer is laminated to the flexible glass layer. A neutral axis of the flexible glass laminate is located outside the flexible glass layer when the flexible glass layer is in a compressive bend configuration.