Patents by Inventor Robert Lenart

Robert Lenart has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220040941
    Abstract: A method of manufacturing a plurality of optical elements comprising the steps of providing a substrate (120) providing a tool (100) comprising, a plurality of replication sections (106) each defining a surface structure of one of the optical elements, and at least one contact spacer portion (112), aligning the tool (100) and the substrate (120) with respect to each other and bringing the tool (100) and a first side of the substrate (120) together, with replication material (124) between the tool (100) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (120), hardening the replication material (124), and separating the tool (100) from the substrate (120) with the hardened replication material adhering to the substrate (120), wherein the tool (100) has yard line features (304) around at least a portion of the replication sections (106), the yard line features (304) configured to contain the replication material (124) on a first side of the yard line with respec
    Type: Application
    Filed: December 17, 2019
    Publication date: February 10, 2022
    Inventors: Sonja Gantner, Tobias Senn, Robert Lenart, Alexander Bietsch
  • Patent number: 11171249
    Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 9, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Robert Lenart, Sonja Gantner-Hanselmann, Özkan Ahishali
  • Patent number: 11114593
    Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: September 7, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Robert Lenart, Sonja Gantner, Oezkan Ahishali
  • Publication number: 20210199475
    Abstract: An example optical encoder includes a rotary shaft having a rotational axis. The rotary shaft is actuatable along the rotational axis. The optical encoder also includes at least one light generating element operable to generate light, and at least one light detecting element operable to detect light and convert the detected light into a signal. The rotary shaft includes a portion operable to reflect light generated from the at least one light generating element onto the at least one light detecting element wherein the signal is generated. The portion is configured such that an actuation of the rotary shaft from a first position to a second position generates a corresponding change in the signal generated in the at least one light detecting element.
    Type: Application
    Filed: February 7, 2019
    Publication date: July 1, 2021
    Inventors: Markus Dantler, Alison Marie Jäggi, Robert Lenart, Nicola Spring
  • Patent number: 11013123
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: May 18, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Patent number: 10877239
    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: December 29, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
  • Publication number: 20200176615
    Abstract: Wafer-level methods for manufacturing one or more uniform layers of material on one or more surfaces of a plurality of optoelectronic modules include assembling a wafer assembly, injecting a formable material into the wafer assembly, ejecting excess formable material form the wafer assembly, and hardening one or more formable material layers on one or more surfaces of the plurality of optoelectronic modules such that the hardened one or more formable material layers are the one or more uniform layers of material.
    Type: Application
    Filed: July 24, 2018
    Publication date: June 4, 2020
    Inventors: Robert Lenart, Sonja Hanselmann, Özkan Ahishali
  • Publication number: 20200045828
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Application
    Filed: October 9, 2019
    Publication date: February 6, 2020
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Publication number: 20190288166
    Abstract: This disclosure describes optoelectronic modules, methods for manufacturing pluralities of discrete optoelectronic modules, and optoelectronic molding tools. The methods include coating a substrate wafer and a plurality of optoelectronic components with a photosensitive material, and further include exposing select portions of the photosensitive material to electromagnetic radiation. The exposed portions delineate at least in part the dimensions of the optical channels, wherein the optical channels are associated with at least one optoelectronic component. In some instances, optical elements are incorporated into the optical channels. In some instances, the exposed portions are the optical channels. In some instances, the exposed portions are spacers between the optical channels.
    Type: Application
    Filed: November 30, 2017
    Publication date: September 19, 2019
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Robert Lenart, Sonja Hanselmann, Oezkan Ahishali
  • Patent number: 10373996
    Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: August 6, 2019
    Assignee: ams Sensors Singapore Pte. Ltd
    Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
  • Patent number: 10352764
    Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: July 16, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jens Geiger, Frank Sobel, Rene Kromhof, Alberto Soppelsa, Kevin Hauser, Robert Lenart
  • Patent number: 10317254
    Abstract: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: June 11, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Jens Geiger, Nicola Spring, Robert Lenart, Bassam Hallal, Hakan Karpuz
  • Patent number: 10236314
    Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: March 19, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Markus Rossi, Hartmut Rudmann, Stephan Heimgartner, Alexander Bietsch, Robert Lenart
  • Publication number: 20180329175
    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.
    Type: Application
    Filed: November 4, 2016
    Publication date: November 15, 2018
    Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
  • Publication number: 20180302990
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Application
    Filed: October 7, 2016
    Publication date: October 18, 2018
    Inventors: Bojan Tesanovic, Simon Gubser, Robert Lenart, Mario Cesana
  • Publication number: 20180172483
    Abstract: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).
    Type: Application
    Filed: March 18, 2015
    Publication date: June 21, 2018
    Inventors: Jens GEIGER, Nicola SPRING, Robert LENART, Bassam HALLAL, Hakan KARPUZ
  • Publication number: 20170317126
    Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
    Type: Application
    Filed: July 17, 2017
    Publication date: November 2, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
  • Patent number: 9748297
    Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
    Type: Grant
    Filed: February 11, 2014
    Date of Patent: August 29, 2017
    Assignee: Heptagon Micro Optics Pte. Ltd.
    Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
  • Publication number: 20170089757
    Abstract: An optoelectronic module that includes a reflectance member which exhibits mitigated or eliminated fan-out field-of-view overlap can be concealed or its visual impact minimized compared to a host device in which the optoelectronic module is mounted. In some instances, the reflectance member can be implemented as a plurality of through holes and in other instances the reflectance member may be a contiguous spin-coated polymeric coating. In general, the reflectance member can be diffusively reflective to the same particular wavelengths or ranges of wavelengths as the host device in which it is mounted.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 30, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Jens Geiger, Frank Sobel, Rene Kromhof, Alberto Soppelsa, Kevin Hauser, Robert Lenart
  • Publication number: 20170077162
    Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.
    Type: Application
    Filed: November 2, 2016
    Publication date: March 16, 2017
    Applicant: Heptagon Micro Optics Pte. Ltd.
    Inventors: Markus Rossi, Hartmut Rudmann, Stephan Heimgartner, Alexander Bietsch, Robert Lenart