Abstract: A process for fabricating a MEMS device is disclosed. The device has at least one hinged element. The MEMS device including the hinged element is delineated and defined on a semiconductor substrate. The substrate is placed device side down in a chamber. The MEMS device is then exposed to a release expedient for sufficient amount of time for the release expedient to dissolve a sacrificial material connecting the element to the substrate. Upon the dissolution of the sacrificial material, the element is released from the substrate and pivots away from the surface.

Abstract: A faceplate for network switching apparatus is formed of a multi-layered structure having a first material layer and a second material layer. An outer portion of the faceplate is formed of the first material layer. The first material layer is an anti static material. An inner portion of the faceplate is formed of the second material layer. The second material layer is formed of an electromagnetic interference (EMI) shielding material. The first material layer and the second material layer are formed of polymeric materials which are rigid after extrusion. In an alternative embodiment, a gasket is coextruded with the first material layer and the second material layer. The gasket protrudes laterally from the inner portion of the faceplate along the length thereof. The gasket is formed of a third material layer. The third material layer is an EMI shielding material. The third material layer is formed of a polymeric material which is flexible after extrusion.

Abstract: Measurement of the delamination resistance of polymer coated optical fiber can provide valuable information for quality control and/or coating development, and a method of making polymer coated optical fiber that includes determination of the delamination resistance is disclosed. Also disclosed is apparatus that facilitates determination of the delamination resistance.

Abstract: A network interface device includes a weatherable enclosure having injection molded, die cast, or stamped top and bottom cap portions and a body portion which is extruded. The injection molded portions are fabricated from a polymer, such as polyvinyl chloride, with a higher melt index than the grade of polymer used to fabricate the body portion. The body portion has top and bottom openings adapted to receive the top and bottom cap portions. The network interface electrical components are enclosed within the housing.