Abstract: A membrane actuator includes a magnetically actuatable membrane and a magnetic trigger. The membrane includes a shape memory alloy (SMA), and the magnetic trigger is configured to induce a martensitic transformation in the SMA, to produce a larger force than would be achievable with non-SMA-based materials. Such a membrane actuator can be beneficially incorporated into a wide variety of devices, including fluid pumps, shock absorbing systems, and synthetic jet producing devices for use in an aircraft. The membrane/diaphragm can be formed from a ferromagnetic SMA, or a ferromagnetic material can be coupled with an SMA such that the SMA and the ferromagnetic material move together. A hybrid magnetic trigger, including a permanent magnet and an electromagnet, is preferably used for the magnetic trigger, as hybrid magnetic triggers are easy to control, and produce larger magnetic gradients than permanent magnets or electromagnets alone.

Abstract: An outgoing message composed on a mobile wireless communication device may be recognized as including a Short Messaging Service (SMS) destination address in an addressing field. The outgoing message may then be processed to create a SMS message payload. The SMS message payload may then be passed to a SMS client application executed on the wireless communication device with an indication of the SMS destination address so that the SMS client application may form an SMS message based on the SMS message payload and the indication of the SMS destination address.

Abstract: A heat-dissipating structure and a manufacturing method thereof are provided The heat-dissipating structure includes a heat piece and a heat sink, wherein the heat piece includes an opening, a containing space, a wall surrounding the containing space, and a relatively high-volatility liquid is filled in the containing space. The manufacturing method includes steps of connecting the heat sink with the wall of the containing space for sealing the containing space by the heat sink, filling the containing space with the relatively high-volatility liquid through the opening, and closing the opening.

Abstract: An environment protection concerned method for manufacturing a heat sink includes the steps of: (a) putting a main material with a top into a die; (b) placing a heat transfer promoting material on the top of the main material, wherein the heat transfer promoting material has a thermal conductivity larger than that of the main material; and (c) forging the heat transfer promoting material and the main material to form a heat sink having a plurality of radiation fins.

Abstract: A heat-dissipating device for a display is provided. The flat display includes a screen, a light source module, a control circuit board and a case with plural holes. The heat-dissipating device is made of heat-dissipating materials. The heat-dissipating device further includes a first heat-dissipating module and a second heat-dissipating module connected to the first heat-dissipating module. The heat-dissipating parts in the first heat-dissipating module form a plurality of spaces. And the convectional channel is formed by the first heat-dissipating module and the second heat-dissipating module. Finally the heat generated from light source module and the control circuit board is dissipated via the convectional channel and the plural of holes on the case.

Abstract: An environment protection concerned method for manufacturing a heat sink comprises steps of: (a) putting a main material with a top into a die; (b) placing a heat transfer promoting material on the top of the main material, wherein the heat transfer promoting material has a thermal conductivity larger than that of the main material; and (c) forging the heat transfer promoting material and the main material to form a heat sink having a plurality of radiation fins.

Abstract: An anchor base for a heat sink for an IC chipset is formed basically in a rectangular frame comprising: two lateral plates respectively formed at the bottom of two opposite lateral stiles of the rectangular frame, each of the two opposite lateral plates having a respective snap barb at its lower portion; a longitudinal resilient rod bridging the other two opposite lateral stiles of the rectangular frame, wherein two ends of the longitudinal resilient rod are extended downwardly to form a pair of protruding rods which are no shorter than the height of the lateral plates; a shorter resilient rod crossing the longitudinal resilient rod; wherein a protrusion is formed at the bottom of each of two ends of the shorter resilient rod. Thus, an anchor base for a heat sink can be made without any extra perforation or cutting steps.

Abstract: An anchor base for heat sink of IC chipset is formed basically in a rectangular frame comprising: two lateral plates respectively formed at the bottom of the two opposite lateral stiles of the rectangular frame, each of the two opposite lateral plates having respective snap barb at its lower portion; a longitudinal resilient rod striding the rest two opposite lateral stiles of the rectangular frame, wherein two ends of the longitudinal resilient rod are extended downwardly to form a pair of protruding rods which are no shorter than the height of the lateral plates; a shorter resilient rod crossing the longitudinal resilient rod, wherein a protrusion is formed on each of two ends of the shorter resilient rod at a lower position.

Abstract: A heat sink dissipater includes a retaining device and a heat dissipater. A plurality of fins and a plurality of pads or recesses are integrally formed on the top surface of the heat dissipater. A plurality of resilient legs extend inward from the sides of the retaining device. Retaining edges are also formed on two sides of the retaining device. The resilient legs fall into the gaps between the fins when the retaining device is positioned on the heat dissipater to secure a CPU assembly. In an orientation, the legs are placed on the pads or recesses of the heat dissipater and in an orthogonal orientation, the legs are placed directly on the top surface of the heat dissipater. Therefore, CPU assemblies of different thickness can be accommodated by rotating the retaining device or the heat dissipater 90 degrees.

Abstract: An improved fix base of a heat sink used to dissipate the heat produced by an integrated circuit chipset in a personal computer is disclosed. The fix base includes a rectangular frame, which has two side plates downwards below the bottom of the two opposite sides. Each bottom part of the two opposite inner sides of the two side plates has a fastening hook, respectively. Each of the other two sides of the two side plates has a protruding rod downwards. A plurality of elastic rods are included in the inner side walls, and each elastic rod includes a protruding part at the bottom. The heat sink is inserted into the rectangular frame and then the chipset is hooked at the two respective sides by the fastening hooks. The protruding parts, further, press onto the top of the heat sink to tightly and closely attach the heat sink and the chipset. The heat sink may include a hole which is drilled for the protruding rod to penetrate in order to position the fix base and the heat sink.

Abstract: An improvement of the structure of a CPU radiator comprises a radiating structure and a fixing seat. The radiating structure is combined with a heat conducting plate projected from the radiating structure. The fixing seat has a hole for being passed by the heat conducting plate. One surface of the fixing seat near the edge of the hole being installed with convex elements on the two opposite sides. After the heat conducting plate has passed through the hole of the fixing seat, the radiating structure is rotated with respect to the fixing seat so that the edge of the heat conducting plate slides upwards along the convex elements. Thus, the fixing seat and the radiating structure are tightly fixed, and then it is buckled on the edge of the CPU by the hooks.