Abstract: A mounting system for supporting computing devices in a rack of the type having at least two vertical posts. The mounting system includes four mounting bases, each base includes an elongated strip having a flange at one end thereof for attachment to a post. Each strip has a generally planar section that is vertically oriented when the flange is attached to a post, and a curved section at top and bottom edges of the planar section which curve in a direction away from the flange.

Abstract: A mounting system for supporting computing devices in a rack of the type having at least two vertical posts. A pair of generally L-spaced brackets are adapted to be respectively mounted to the two posts, each of the brackets having a first elongated strip that is vertically disposed when the bracket is mounted on one of the two posts, and a second elongated strip at one edge of the first elongated strip that is horizontally disposed when the bracket is mounted on a post to form a support surface for the computing device. The second elongated strip has a curvature adjacent the first elongated strip that forms a ridge along the length of the strip upon which a computing device rests when supported by the bracket.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: A shock mounting system for data storage modules that house disk drives such as those used in RAID systems. In one embodiment of the invention, a flexible spacer formed on or fastened to the module housing provides the desired tight but cushioned fit between the module and the enclosure. In a second embodiment, a flexible guide formed on or fastened to the enclosure that houses the modules provides the desired fit.

Abstract: A shock mounting system for data storage modules that house disk drives such as those used in RAID systems. In one embodiment of the invention, a flexible spacer formed on or fastened to the module housing provides the desired tight but cushioned fit between the module and the enclosure. In a second embodiment, a flexible guide formed on or fastened to the enclosure that houses the modules provides the desired fit.

Abstract: A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

Abstract: This invention relates to a fluid distribution manifold, where the input piping is inserted in through the manifold's circular intake opening and onto its cylindrical input port. The manifold's intake opening leads through a cylindrical path to a closed terminal end. Along the inner manifold wall, there are arranged in a sequence, which may be in a straight line, a series of straight lines or rows, a spiral, or an alternating 90- or 180-degree arrangement, a number of distribution outlet openings and their respective ports, which may be barbed or ribbed on their outer surface. The manifold has the further utility of being expandable to larger sizes. This is achieved by removing the closed terminal end from one manifold and then inserting and connecting that open terminal end in through another manifold's circular intake opening and into its intake port.

Abstract: This invention relates to an in-line and frame independent electric blower half-housing, with cylindrical walls or essentially nonparallel interior walls constructed of an elastomeric material, and which is thereby acoustically silenced and is also easily disassembled for maintenance. The blower half-housing consists of one piece. The blower half-housing was designed for use in the spa industry, as an air blower, but has applications in other industries.

Abstract: This invention relates to an in-line and frame independent electric blower housing, with cylindrical walls or essentially nonparallel interior walls constructed of an elastomeric material, and which is thereby acoustically silenced and is also easily disassembled for maintenance. The blower housing consists of two halves and may be adapted to house a larger motor, through the fitting of an adapt or collar device between the two halves of the blower housing. The blower housing was designed for use in the spa industry, as an air blower, but has applications in other industries.

Abstract: This invention relates to a fluid distribution manifold, where the input piping is inserted in through the manifold's circular intake opening and into its cylindrical intake port. The manifold's intake port has an intake restraint rim on its inner surface in order to prevent the intake piping from being inserted too far into the manifold. In some embodiments, the manifold also has a glue trap located below the intake restraint rim, and of approximately the same dimensions and geometry as the intake restraint rim. The manifold's intake port leads to a cup- or parabola-shaped intake reservoir, where fluid is briefly housed prior to its distribution through several distribution output opening, and their respective distribution outlet ports. In some embodiments, the manifold's distribution outlet ports each possess an output restraint rim on the inner surface of each of the distribution outlet ports, to prevent the output piping from being inserted too far into the port.