Patents by Inventor Robert Lum

Robert Lum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8133096
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: March 13, 2012
    Assignee: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Publication number: 20090278081
    Abstract: A method for forming a polishing media and an article of manufacture is described. The article of manufacture may be formed into a polishing article. The polishing article includes a polymer base material and a plurality of nano-scale structures disposed in or on the polymer base material.
    Type: Application
    Filed: March 25, 2009
    Publication date: November 12, 2009
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Hichem M'Saad, Lakshmanan Karuppiah, Hung Chih Chen, Jeonghoon Oh, Robert Lum, Stan D. Tsai, Cassio Conceicao, Ashish Bhatnagar, Michael Perry, Kadthala Narendrnath, Yosi Shacham-Diamand
  • Patent number: 7109330
    Abstract: Compounds of the following formula are provided: In the Formula (I), R1 is —X—R1?; in which R1? is optionally substituted lower alkyl, optionally substituted aryl, optionally substituted heteroaryl, or optionally substituted heterocyclyl, and X is —NH—. R2 is lower alkyl optionally substituted with one, two or three groups chosen from hydroxy, lower alkoxy, and halogen. And R3 is —NR4R5; in which R4 is hydrogen and R5 is lower alkyl substituted with amino; or (ii) R4 and R5 are both lower alkyl optionally substituted with one, two or three groups chosen from hydroxy and amino. It is to be understood that R1? is not cyclohexylmethyl, phenyl, substituted phenyl, benzyl, phenylethyl, or m-hydroxybenzyl. The compounds inhibit CDK-2 activity and are useful for treating disorders characterized by undesirable cell proliferation.
    Type: Grant
    Filed: March 3, 2004
    Date of Patent: September 19, 2006
    Assignee: CV Therapeutics, Inc.
    Inventors: Robert Lum, Cheri Lynn Blum, Richard Mackman, Michael Wick, Steven Schow, Jeff Zablocki, Prabha Ibrahim
  • Patent number: 7048607
    Abstract: Generally, a method and apparatus for processing a substrate. In one embodiment, the method provides a first relative motion between at least a first substrate and a polishing material. A second relative motion is provided between at least a second substrate and the polishing material. The changing in direction of the relative motion extends the interval between conditioning procedures used to return the polishing material to a state that produces uniform polishing results.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: May 23, 2006
    Assignee: Applied Materials
    Inventors: Li Wu, Sourabh Mishra, Young J. Paik, Satyasrayan Kumaraswamy, Robert Lum, Chiu Chan, David Groechel
  • Publication number: 20050189235
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Application
    Filed: February 22, 2005
    Publication date: September 1, 2005
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Publication number: 20050080261
    Abstract: Compounds of the following formula are provided: In the Formula (I), R1 is —X—R1?; in which R1? is optionally substituted lower alkyl, optionally substituted aryl, optionally substituted heteroaryl, or optionally substituted heterocyclyl, and X is —NH—. R2 is lower alkyl optionally substituted with one, two or three groups chosen from hydroxy, lower alkoxy, and halogen. And R3 is —NR4R5; in which R4 is hydrogen and R5 is lower alkyl substituted with amino; or (ii) R4 and R5 are both lower alkyl optionally substituted with one, two or three groups chosen from hydroxy and amino. It is to be understood that R1? is not cyclohexylmethyl, phenyl, substituted phenyl, benzyl, phenylethyl, or m-hydroxybenzyl. The compounds inhibit CDK-2 activity and are useful for treating disorders characterized by undesirable cell proliferation.
    Type: Application
    Filed: March 3, 2004
    Publication date: April 14, 2005
    Inventors: Robert Lum, Cheri Blum, Richard Mackman, Michael Wick, Steven Schow, Jeffery Zablocki, Prabha Ibrahim
  • Patent number: 6857941
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacture may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Grant
    Filed: May 2, 2002
    Date of Patent: February 22, 2005
    Assignee: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Publication number: 20020197946
    Abstract: An article of manufacture, a method, and an apparatus for use in a chemical mechanical polishing system is provided. In one aspect, an article of manufacture is provided for polishing a substrate including a polishing article having a polishing surface, the polishing surface including a first polishing portion having a first polishing material of a first hardness for polishing a first portion of the substrate, and a second polishing portion having a second polishing material of a second hardness for polishing a second portion of the substrate. The article of manufacturer may be disposed on a rotatable, stationary, or linear platen for processing a substrate. In another aspect, a method is provided for processing a substrate, including providing a platen containing the polishing article disposed on the rotatable platen, delivering a polishing composition to the polishing article, and contacting a substrate on the polishing article.
    Type: Application
    Filed: May 2, 2002
    Publication date: December 26, 2002
    Applicant: Applied Materials, Inc.
    Inventors: Ramin Emami, Robert Lum, Sourabh Mishra
  • Patent number: 5338398
    Abstract: A process for etching tungsten silicide on a semiconductor wafer in a vacuum etch chamber in the presence of a plasma is described using chlorine (Cl.sub.2) and oxygen-bearing etchant gases in a ratio of not more that 20 volume % oxygen-bearing etchant gas, and preferably from about 6 to about 10 volume % oxygen-bearing etchant gas. The process is also capable of etching polysilicon and exhibits a high selectivity for both photoresist and oxide.
    Type: Grant
    Filed: December 23, 1992
    Date of Patent: August 16, 1994
    Assignee: Applied Materials, Inc.
    Inventors: Chester A. Szwejkowski, Robert Lum, Thierry Fried