Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: Embodiments described herein include a vessel, for example, a beverage container, configured for containing a liquid. The vessel may be formed of a metal body and includes an interior surface barrier layer with a pre-determined surface roughness. In embodiments, the interior surface barrier layer includes a mirror-like, highly reflective finish. In additional or alternative embodiments, the interior surface barrier layer includes an oxide of chromium. In embodiments, the interior surface barrier layer substantially prevents chemical components from the metal body from leaching into the contained liquid. In embodiments, the interior surface barrier layer promotes cleanability and/or sterilization for vessel reuse.

Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: In one aspect, there is provided an antimicrobial compound having the formula [Mex(NH3)y]—Z, where Me is a metal selected from the group consisting of copper, silver and zinc, and Z is selected from the group consisting of, a salt of an organic acid having at least one (—COOH) functional group, or a salt of an inorganic acid.

Abstract: Disclosed is a metal bottle interior processed to stop nickel leaching and taste altering effects. A process of stainless steel passivation performed with machines attached to specific expanding buffing cloths coated with buffing compounds or fine abrasives such as jewelers rouge. A chemical or electrical process may also be performed.

Abstract: The present invention comprises a metal graphic formed on a surface (2), wherein said graphic comprises discrete wire elements (1) that are attached to said surface.

Abstract: A device for grinding coffee beans one shot at a time. The device may consist of an inlet funnel attached to a main body, wherein the beans are gravity fed to a set of burrs that grind the coffee into a grounds chamber, where they are then expunged into a grounds receptacle. The grounds receptacle may be adjusted in height via arms attached to the grinder depending on the workflow of the user and the type of receptacle being used. The grounds chamber is a clamshell design easily removable by the user for cleaning and held in place with magnets and alignment pins. As the grinder grinds coffee, wipers on the mounts for the burr create a positive pressure air flow to expunge the ground beans in addition to physically manipulating them out of the exit chute. This allows for grinding and expulsion of all of the input coffee without retention, a common problem in the industry when grinders are used for single shot grinding.

Abstract: A device for steaming and/or foaming milk primarily for, but not limited to, coffee beverages. The device attaches via machined threads to a standard coffee machine steam wand, but nonstandard sizes can be accommodated via a thread adapter. The device consists of two machined stainless pieces each with crescent shaped apertures that, when rotated relative to each other, allow for the increase or decrease in effective hole size to adjust the volume and pressure of steam being expunged. This adjustability allows for the user to decrease the aperture when foaming a small amount of milk (e.g. for a macchiato), or to increase the aperture for foaming more milk (e.g. for a latte).

Abstract: A device for precise dispensation of whole coffee beans. The device may consist of a coffee bean hopper attached to an incremental dispensation device such as a toothed gear rotated by a stepper motor, whereby the rotation of the gear precisely dispenses whole coffee beans into a receptacle mounted upon a load cell or other weighing device. As the beans are dispensed into the receptacle, a PCB or other electronic component controls a feedback loop from the weighing device to the motor such that the dispensed amount is within +/?one coffee bean in weight. The desired weight may be input via buttons attached to the PCB with a readout that allows 0.1 g accuracy, or roughly the weight of one coffee bean.

Abstract: A bonding wire comprises a core wire generally made of silver or a silver alloy, and the coating material is selected from one or more of: gold, palladium, platinum, rhodium. Alternatively, the core wire is generally made of copper or a copper alloy, and the coating material is selected from one or more of: palladium, platinum, rhodium, iridium, ruthenium.

Abstract: A system is provided for reducing a penalty period for a vehicle. The vehicle includes a braking system that switches into an application state upon commencement of the penalty period. The braking system includes a fluid carrying brake pipe which connects a first powered unit and a remote powered unit. The system includes a sensor positioned within the vehicle, which measures a parameter related to the operation of the braking system. A control processor is positioned within the first powered unit, and is coupled to the sensor. Subsequent to the commencement of the penalty period, the control processor monitors the measured parameter and switches the braking system from the application state into a release state to reduce the penalty period, based on the measured parameter falling within a predetermined safety range.

Abstract: The present invention comprises a metal graphic formed on a surface (2), wherein said graphic comprises discrete wire elements (1) that are attached to said surface.

Abstract: A system is provided for reducing a penalty period for a vehicle. The vehicle includes a braking system that switches into an application state upon commencement of the penalty period. The braking system includes a fluid carrying brake pipe which connects a first powered unit and a remote powered unit. The system includes a sensor positioned within the vehicle, which measures a parameter related to the operation of the braking system. A control processor is positioned within the first powered unit, and is coupled to the sensor. Subsequent to the commencement of the penalty period, the control processor monitors the measured parameter and switches the braking system from the application state into a release state to reduce the penalty period, based on the measured parameter falling within a predetermined safety range.

Abstract: A system is provided for reducing a penalty period for a distributed power train. The distributed power train includes a braking system that switches into an application state upon commencement of the penalty period. The braking system includes a fluid carrying brake pipe which connects a first locomotive and a remote locomotive. The system includes a sensor positioned within the distributed power train, which measures a parameter related to the operation of the braking system. A control processor is positioned within the first locomotive, and is coupled to the sensor. Subsequent to the commencement of the penalty period, the control processor monitors the measured parameter and switches the braking system from the application state into a release state to reduce the penalty period, based on the measured parameter falling within a predetermined safety range. Additionally, a method is provided for reducing a penalty period for a distributed power train.

Abstract: A system is provided for reducing a penalty period for a distributed power train. The distributed power train includes a braking system that switches into an application state upon commencement of the penalty period. The braking system includes a fluid carrying brake pipe which connects a first locomotive and a remote locomotive. The system includes a sensor positioned within the distributed power train, which measures a parameter related to the operation of the braking system. A control processor is positioned within the first locomotive, and is coupled to the sensor. Subsequent to the commencement of the penalty period, the control processor monitors the measured parameter and switches the braking system from the application state into a release state to reduce the penalty period, based on the measured parameter falling within a predetermined safety range. Additionally, a method is provided for reducing a penalty period for a distributed power train.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.

Abstract: A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.

Abstract: A pneumatic braking method and system for a vehicle is provided. The system includes a brake cylinder, a reservoir, a latching exhaust valve (LEV) movable between an open position and closed position and fluidly connected between the reservoir and the brake cylinder. The LEV includes a first solenoid having a first pilot fluidly connected to the reservoir and a second solenoid having a second pilot fluidly connected to the reservoir wherein the pilots are configured to be controlled electronically and pneumatically, and are selectable between electronic and pneumatic control based on vehicle operating requirements. The solenoids are configured to be piloted with pneumatic pressure from the reservoir and an electronic controller that includes a release on failure circuit. The release on failure circuit is configured to control the LEV during at least one of a loss of power to the braking system and a failure of the electronic controller.