Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: In one aspect, there is provided a metal-infused, antimicrobial material comprising a base substrate including at least one organic compound with a functional group, a seed layer that is chemically bonded to the base substrate and has a chemical structure including an ion of an antimicrobial metal that is chemically bonded to the functional group via a coordinated covalent bond, and a bulk metal layer of a metal oxide or a metal hydroxide of the antimicrobial metal that is chemically bonded to the seed layer, where the bulk layer has a chemical structure including at least one molecule of the metal oxide or the metal hydroxide of the antimicrobial metal that is bonded to the ion of the antimicrobial metal in the seed layer via a metal-oxide ionic bond. In another aspect, there is provided a method for preparing a metal-infused, antimicrobial material as disclosed herein.

Abstract: In one aspect, there is provided an antimicrobial compound having the formula [Mex(NH3)y]—Z, where Me is a metal selected from the group consisting of copper, silver and zinc, and Z is selected from the group consisting of, a salt of an organic acid having at least one (—COOH) functional group, or a salt of an inorganic acid.

Abstract: The present invention comprises a metal graphic formed on a surface (2), wherein said graphic comprises discrete wire elements (1) that are attached to said surface.

Abstract: A bonding wire comprises a core wire generally made of silver or a silver alloy, and the coating material is selected from one or more of: gold, palladium, platinum, rhodium. Alternatively, the core wire is generally made of copper or a copper alloy, and the coating material is selected from one or more of: palladium, platinum, rhodium, iridium, ruthenium.

Abstract: The present invention comprises a metal graphic formed on a surface (2), wherein said graphic comprises discrete wire elements (1) that are attached to said surface.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.

Abstract: A process for bonding insulated wires is provided wherein a conforming free air ball is formed from an insulated wire to create a ball bond. A tip of the insulated wire is first positioned close to an electronic flame-off device and a first electric discharge is produced from the electronic flame-off device to melt the tip of the insulated wire and produce a pilot ball. The electric discharge is then terminated. A second electric discharge is then generated to produce the conforming free air ball, and thereafter, the conforming free air ball is attached to a bonding surface to create the ball bond.

Abstract: A novel wire-based interconnect IC package is described as well as the method of designing and the method of producing the IC package. The IC package includes one or more signal carrying wires as well as ground return wires associated with each signal carrying wire to electrically couple a chip to a carrier substrate. Both the signal carrying wire and its associated ground return wires may be insulated, however at least the signal carrying wire or the ground wires are insulated. The inductance of the signal carrying wires can be kept low by keeping the wirebonds as short as possible and by positioning a number of ground wires symmetrically about and in close proximity to the signal carrying wire. The signal carrying wires and the ground return wires are connected to bond pads on the chip and to bond fingers on the carrier substrate to couple the chip to the substrate.