Abstract: A bridge rectifier assembly includes: a self aligning cloverleaf shaped diode header which sandwiches each diode chip; a semi-circular heat and electrically conductive plate accommodated with receptacles to position the cloverleaf diodes; a heat and non-electrical conductive insulator; a finned heat and electrical conductive extrusion with similar receptacles to position the cloverleaf diodes; an articulated terminal to provide thermal and mechanical stress relief executing an electrode function adhered to the cloverleaf diode header; and a molded insulated integument with embedded electrical conductors of a cantilevered configuration to further alleviate thermodynamic and mechanical stresses. A second embodiment repeats the first embodiment, and includes a heat and electrical conductive plate that is larger in area and with the extrusion succeeded by a second plate of identical outline as the first.