Patents by Inventor Robert Metter

Robert Metter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protecting thin semiconductor wafers during back-grinding in high-volume production
    Patent number: 7186629
    Abstract: A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 ?m, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: March 6, 2007
    Assignee: Advanced Materials Sciences, Inc.
    Inventors: Mark Wesselmann, Kostadin Petkov, Robert Metter, Michael S. Wisnieski, John Boyd
  • Protecting thin semiconductor wafers during back-grinding in high-volume production
    Publication number: 20060008650
    Abstract: A protective disk for protecting a semiconductor wafer during processing includes an adhesive layer configured to adhere to the semiconductor wafer and a support layer coupled to the adhesive layer configured to provide strength and stiffness to the semiconductor wafer during processing. In one aspect of the invention, the protective disk is soluble in a mildly alkaline or mildly acidic solution. In another aspect, the adhesive layer comprises a high molecular weight polymer. In another aspect, the support layer comprises a polymer and a filler. The present invention may enable a robust, cost-effective, high-volume, automated process for thinning semiconductor wafers below 150 ?m, and for subsequent process steps of stress relief and transfer to a dicing frame for die singulation. Additionally, the invention enables use of existing toolsets and processes to produce thinner substrates than conventionally achievable.
    Type: Application
    Filed: November 19, 2003
    Publication date: January 12, 2006
    Inventors: Mark Wesselmann, Kostadin Petkov, Robert Metter, Michael Wisnieski, John Boyd