Patents by Inventor Robert M. Gillespie, Jr.

Robert M. Gillespie, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5973924
    Abstract: An integrated circuit package assembly that allows an integrated circuit package to be plugged into another integrated circuit package that is mounted to a printed circuit board. The assembly includes a first integrated circuit package assembly that is mounted to the printed circuit board. The first assembly includes a first integrated circuit package that contains a plurality of holes on the top surface of the package. The mating pins of a second integrated circuit package assembly can be plugged into the holes to couple the second assembly to the first assembly. The second integrated circuit package assembly can be added without occupying additional board space on the printed circuit board.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: October 26, 1999
    Assignee: Intel Corporation
    Inventor: Robert M. Gillespie, Jr.