Patents by Inventor Robert M. Hintz
Robert M. Hintz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11916263Abstract: A cross-flow interconnect and a fuel cell stack including the same, the interconnect including fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side; and an opposing fuel side. The air side includes an air flow field including air channels that extend in a first direction, from a third peripheral edge of the interconnect to an opposing fourth peripheral edge of the interconnect; and riser seal surfaces disposed on two opposing sides of the air flow field and in which the fuel inlets and outlets are formed. The fuel side includes a fuel flow field including fuel channels that extend in a second direction substantially perpendicular to the first direction, between the fuel inlets and outlets; and a perimeter seal surface surrounding the fuel flow field and the fuel inlets and outlets.Type: GrantFiled: May 11, 2022Date of Patent: February 27, 2024Assignee: BLOOM ENERGY CORPORATIONInventors: Michael Gasda, Vijay Srivatsan, Robert M. Hintz, Swaminathan Venkataraman, Padiadpu Shankara Anantha, Emad El Batawi, Cheng-Yu Lin, Sagar Mainkar, Gilbert Richards, Jonathan Scholl
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Publication number: 20220278341Abstract: A cross-flow interconnect and a fuel cell stack including the same, the interconnect including fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side; and an opposing fuel side. The air side includes an air flow field including air channels that extend in a first direction, from a third peripheral edge of the interconnect to an opposing fourth peripheral edge of the interconnect; and riser seal surfaces disposed on two opposing sides of the air flow field and in which the fuel inlets and outlets are formed. The fuel side includes a fuel flow field including fuel channels that extend in a second direction substantially perpendicular to the first direction, between the fuel inlets and outlets; and a perimeter seal surface surrounding the fuel flow field and the fuel inlets and outlets.Type: ApplicationFiled: May 11, 2022Publication date: September 1, 2022Inventors: Michael GASDA, Vijay SRIVATSAN, Robert M. HINTZ, Swaminathan VENKATARAMAN, Padiadpu Shankara ANANTHA, Emad EL BATAWI, Cheng-Yu LIN, Sagar MAINKAR, Gilbert RICHARDS, Jonathan SCHOLL
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Patent number: 11355762Abstract: A cross-flow interconnect and a fuel cell stack including the same, the interconnect including fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side; and an opposing fuel side. The air side includes an air flow field including air channels that extend in a first direction, from a third peripheral edge of the interconnect to an opposing fourth peripheral edge of the interconnect; and riser seal surfaces disposed on two opposing sides of the air flow field and in which the fuel inlets and outlets are formed. The fuel side includes a fuel flow field including fuel channels that extend in a second direction substantially perpendicular to the first direction, between the fuel inlets and outlets; and a perimeter seal surface surrounding the fuel flow field and the fuel inlets and outlets.Type: GrantFiled: May 29, 2019Date of Patent: June 7, 2022Assignee: BLOOM ENERGY CORPORATIONInventors: Michael Gasda, Vijay Srivatsan, Robert M. Hintz, Swaminathan Venkataraman, Padiadpu Shankara Anantha, Emad El Batawi, Cheng-Yu Lin, Sagar Mainkar, Gilbert Richards, Jonathan Scholl
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Publication number: 20190372132Abstract: A cross-flow interconnect and a fuel cell stack including the same, the interconnect including fuel inlets and outlets that extend through the interconnect adjacent to opposing first and second peripheral edges of the interconnect; an air side; and an opposing fuel side. The air side includes an air flow field including air channels that extend in a first direction, from a third peripheral edge of the interconnect to an opposing fourth peripheral edge of the interconnect; and riser seal surfaces disposed on two opposing sides of the air flow field and in which the fuel inlets and outlets are formed. The fuel side includes a fuel flow field including fuel channels that extend in a second direction substantially perpendicular to the first direction, between the fuel inlets and outlets; and a perimeter seal surface surrounding the fuel flow field and the fuel inlets and outlets.Type: ApplicationFiled: May 29, 2019Publication date: December 5, 2019Inventors: Michael GASDA, Vijay SRIVATSAN, Robert M. HINTZ, Swaminathan VENKATARAMAN, Padiadpu Shankara ANANTHA, Emad EL BATAWI, Cheng-Yu LIN, Sagar MAINKAR, Gilbert RICHARDS, Jonathan SCHOLL
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Patent number: 10333163Abstract: A sorbent bed assembly of a fuel cell system, including a first sorbent bed, a second sorbent bed and at least one third sorbent bed, the second sorbent bed disposed between the first sorbent bed and the at least one third sorbent bed, a cover plate on the plurality of sorbent beds and configured to connect the sorbent beds to one another, a fuel inlet connector on the cover plate and configured to receive a fuel, a manifold having a first fluid conduit configured to transport fuel between the first sorbent bed and at least one third sorbent bed, and a second fluid conduit configured to transport fuel between at least one third sorbent bed and the second sorbent bed, and a fuel outlet connector on the cover plate and configured to receive fuel that has passed through each of the sorbent beds.Type: GrantFiled: May 16, 2016Date of Patent: June 25, 2019Assignee: BLOOM ENERGY CORPORATIONInventors: David Trevisan, Arne Ballantine, Bruno Caulk, Ross Parker, Gilbert Richards, Robert M. Hintz, Emma Campbell, Craig Metcho
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Publication number: 20170331133Abstract: A sorbent bed assembly of a fuel cell system, including a first sorbent bed, a second sorbent bed and at least one third sorbent bed, the second sorbent bed disposed between the first sorbent bed and the at least one third sorbent bed, a cover plate on the plurality of sorbent beds and configured to connect the sorbent beds to one another, a fuel inlet connector on the cover plate and configured to receive a fuel, a manifold having a first fluid conduit configured to transport fuel between the first sorbent bed and at least one third sorbent bed, and a second fluid conduit configured to transport fuel between at least one third sorbent bed and the second sorbent bed, and a fuel outlet connector on the cover plate and configured to receive fuel that has passed through each of the sorbent beds.Type: ApplicationFiled: May 16, 2016Publication date: November 16, 2017Inventors: David TREVISAN, Arne BALLANTINE, Bruno CAULK, Ross PARKER, Gilbert RICHARDS, Robert M. HINTZ, Emma CAMPBELL, Craig METCHO
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Patent number: 7870872Abstract: In a cooling system, a variable inline nozzle controls the flow of cooling fluid. The variable inline nozzle includes a composite fibrous tube through which the cooling fluid flows. Upon manipulation of the composite fibrous tube, a diameter of a portion of the composite fibrous tube is adjusted to control the flow of the cooling fluid.Type: GrantFiled: March 30, 2007Date of Patent: January 18, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Vance B. Murakami, Wesley H. Stelter, Robert M. Hintz, John M. Grisham
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Patent number: 7688578Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.Type: GrantFiled: July 19, 2007Date of Patent: March 30, 2010Assignee: Hewlett-Packard Development Company, L.P.Inventors: Ronald M. Mann, Gary S. Landrum, Robert M. Hintz
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Publication number: 20090021907Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.Type: ApplicationFiled: July 19, 2007Publication date: January 22, 2009Inventors: Ronald M. Mann, Gary S. Landrum, Robert M. Hintz
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Publication number: 20080236690Abstract: In a cooling system, a variable inline nozzle controls the flow of cooling fluid. The variable inline nozzle includes a composite fibrous tube through which the cooling fluid flows. Upon manipulation of the composite fibrous tube, a diameter of a portion of the composite fibrous tube is adjusted to control the flow of the cooling fluid.Type: ApplicationFiled: March 30, 2007Publication date: October 2, 2008Inventors: Vance B. Murakami, Wesley H. Stelter, Robert M. Hintz, John M. Grisham
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Publication number: 20040089618Abstract: An apparatus in one example comprises a first electronic device module that comprises a structural stackable rack component that is attached to and supports an electronic device. A second electronic device module that comprises a stackable rack component that is attached to and supports an electronic device is stackable on and detachably coupled to the first electronic device module.Type: ApplicationFiled: November 7, 2002Publication date: May 13, 2004Inventors: Craig Edward Lauchner, Robert M. Hintz
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Patent number: 6626300Abstract: A method and apparatus for easily and inexpensively coupling a chassis to a slide. Computer related components are disposed within a chassis that is disposed within a rack. A sliding assembly that includes an inner slide allows the chassis to be extended from the rack such that the computer related component can be easily replaced or serviced. The inner slide has an opening extending therethrough that is partially covered by a spring that extends over the opening. A protrusion extends from a side surface of the chassis that can be engaged with the opening so as to couple the chassis to the inner slide. When the protrusion is being inserted into the opening, the spring deforms so as to allow the protrusion to enter the uncovered portion of the opening. When the protrusion reaches the uncovered portion of the opening the spring automatically moves back into its undeformed shape so as to engage the protrusion.Type: GrantFiled: December 10, 2001Date of Patent: September 30, 2003Assignee: Hewlett-Packard Development Company, L.P.Inventors: Joseph W. Kaminski, Robert M. Hintz
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Publication number: 20030106865Abstract: A method and apparatus for easily and inexpensively coupling a chassis to a slide. Computer related components are disposed within a chassis that is disposed within a rack. A sliding assembly that includes an inner slide allows the chassis to be extended from the rack such that the computer related component can be easily replaced or serviced. The inner slide has an opening extending therethrough that is partially covered by a spring that extends over the opening. A protrusion extends from a side surface of the chassis that can be engaged with the opening so as to couple the chassis to the inner slide. When the protrusion is being inserted into the opening, the spring deforms so as to allow the protrusion to enter the uncovered portion of the opening. When the protrusion reaches the uncovered portion of the opening the spring automatically moves back into its undeformed shape so as to engage the protrusion.Type: ApplicationFiled: December 10, 2001Publication date: June 12, 2003Inventors: Joseph W. Kaminski, Robert M. Hintz