Abstract: A low profile ringframe used in electro-optical module packaging is disclosed. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-subtrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.

Abstract: Modern optoelectronic components have very tight coupling tolerances. Small misalignments of a strong lens that occur during the alignment and bonding process seriously degrade optical coupling. A weak lens is actively mounted using a flexure to correct misalignments of the strong lens. Since the weak lens does not exert as much steering force on a beam for a similar movement as the strong lens, misalignments that may occur during weak lens positioning and bonding do not appreciably degrade coupling.

Abstract: Modern optoelectronic components have very tight coupling tolerances. Small misalignments of a strong lens that occur during the alignment and bonding process seriously degrade optical coupling. A weak lens is actively mounted using a flexure to correct misalignments of the strong lens. Since the weak lens does not exert as much steering force on a beam for a similar movement as the strong lens, misalignments that may occur during weak lens positioning and bonding do not appreciably degrade coupling.

Abstract: A low profile ringframe used in electro-optical module packaging, for being hermetically sealed, e.g., by a solder joint, to a metalized ceramic substrate base, and to which a deep cover is later hermetically sealed, e.g., by a laser weld, the ringframe's side walls being of sufficiently low height to permit computer-aided viewing from the side, as well as top, of the critical optical fiber end-to-laser diode alignment. The ringframe can be mounted so as to be set back from, be flush with, or be extending exteriorly over the outer end wall of the ceramic substrate, and may also be formed so as to help physically separate the ringframe-to-substrate solder joint from the ringframe-to-laser weld seam. The ringframe, along the side where it is sealed to the adjacent substrate, can be notched with one or more cutout areas to allow a space for wicking of reflowed solder to prevent a built-up solder fillet from forming exteriorly of the ringframe.