Patents by Inventor Robert M. Moon

Robert M. Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8293132
    Abstract: The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin, wherein at least one-third of the primary amine groups of the salted polyamine or the salted polyamine-epoxy adduct are blocked.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: October 23, 2012
    Assignee: Cognis IP Management GmbH
    Inventors: Setsuo Sato, Shailesh C Shah, Ramiro Carielo Bueno, Robert M Moon, Arnaldo Ferreira
  • Publication number: 20100286345
    Abstract: The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin, wherein at least one-third of the primary amine groups of the salted polyamine or the salted polyamine-epoxy adduct are blocked.
    Type: Application
    Filed: December 10, 2008
    Publication date: November 11, 2010
    Applicant: COGNIS IP MANAGEMENT GMBH
    Inventors: Setsuo Sato, Shailesh C. Shah, Ramiro Carielo Bueno, Robert M. Moon, Arnaldo Ferreira
  • Publication number: 20030176627
    Abstract: The invention is an amidoamine epoxy curing agent composition, which comprises the reaction product of at least one aliphatic monobasic carboxylic acid, triethylenetetraamine, and an amine selected from the group consisting of polyethylenepolyamines higher than triethylenetetraamine, cycloaliphatic amines, and mixtures thereof, its method of use, and cured epoxy compositions made from it.
    Type: Application
    Filed: January 22, 2003
    Publication date: September 18, 2003
    Inventors: Shailesh Shah, Robert M. Moon
  • Patent number: 6420496
    Abstract: A curing agent for epoxy resins is prepared by (1) reacting a phenol and an aldehyde in the presence of a basic catalyst to form a first reaction product, (2) reacting the first reaction product with a polyamine or a polyamine-epoxy adduct to form a second reaction product containing unreacted primary amine groups, and (3) reacting the second reaction product with a proton donor compound having a pKa value of 11 or less to form the curing agent.
    Type: Grant
    Filed: October 8, 1999
    Date of Patent: July 16, 2002
    Assignee: Cognis Corporation
    Inventors: Robert M. Moon, Shailesh Shah, Anbazhagan Natesh, Gaetano D. DeAngelis, Joseph L. Mulvey, Ronald T. Cash, Jr.
  • Publication number: 20010011122
    Abstract: The invention is an amidoamine epoxy curing agent composition, which comprises the reaction product of at least one aliphatic monobasic carboxylic acid, triethylenetetraamine, and an amine selected from the group consisting of polyethylenepolyamines higher than triethylenetetraamine, cycloaliphatic amines, and mixtures thereof, its method of use, and cured epoxy compositions made from it.
    Type: Application
    Filed: February 16, 2001
    Publication date: August 2, 2001
    Inventors: Shailesh Shah, Robert M. Moon
  • Patent number: 5770657
    Abstract: Provided are epoxy curing agents comprising the reaction product of reactants consisting essentially of a mono-alkylene polyamine having less than about 12 carbon atoms, an alicyclic diamine in an amount of greater than about 10% of the amine equivalents of said amine component, an aromatic mono-glycidyl ether having less than about 18 carbon atoms, and a diglycidyl ether of an aromatic diol having an average degree of oligomerization of less than about 3.5, wherein the ratio of primary amine equivalents of said alkylene polyamine to the total epoxide equivalents of said aromatic glycidyl ether and said diglycidyl ether of an aromatic diol is are greater than one, and the ratio of epoxide equivalents of said aromatic mono-glycidyl ether to epoxide equivalents of said diglycidyl ether of an aromatic diol is greater than one.
    Type: Grant
    Filed: July 3, 1996
    Date of Patent: June 23, 1998
    Assignee: Henkel Corporation
    Inventors: Jason L. Chou, Shailesh Shah, Brian G. Jewell, Robert M. Moon
  • Patent number: 5583167
    Abstract: Provided are epoxy curing agents comprising the reaction product of reactants consisting essentially of an alkylene polyamine having less than about 12 carbon atoms, an aromatic mono-glycidyl ether having less than about 18 carbon atoms, and a diglycidyl ether of an aromatic diol having an average degree of oligomerization of less than about 3.5, wherein the ratio of primary amine equivalents of said alkylene polyamine to the total epoxide equivalents of said aromatic glycidyl ether and said diglycidyl ether of an aromatic diol is not essentially less than one, and the ratio of epoxide equivalents of said aromatic mono-glycidyl ether to epoxide equivalents of said diglycidyl ether of an aromatic diol is greater than one.
    Type: Grant
    Filed: June 30, 1993
    Date of Patent: December 10, 1996
    Assignee: Henkel Corporation
    Inventors: Jason L. Chou, Shailesh Shah, Brian G. Jewell, Robert M. Moon
  • Patent number: 5508373
    Abstract: A method of curing an epoxy resin comprising mixing an epoxy resin with a curing agent is provided. The curing agent is selected from the group consisting of (i) a mixture consisting essentially of 1,2-diaminocyclohexane and an aliphatic polyamine (preferably at a molar ratio of 1,2-diaminocyclohexane to aliphatic polyamine of from about 1:1 to about 16:1, preferably about 2.5:1 to about 6:1 and more preferably about 3:1 to about 5:1) and (ii) the reaction product of reactants consisting essentially of an amine component consisting essentially of 1,2-diaminocyclohexane and an aliphatic polyamine and an epoxide component. The epoxide component has an epoxy functionality greater than one and is preferably a diglycidyl ether of an aromatic diol having an average degree of oligomerization of less than about 3.5., preferably less than about 1.5, and preferably derived from an alkyl bis-phenol, e.g. bisphenol A.
    Type: Grant
    Filed: August 4, 1994
    Date of Patent: April 16, 1996
    Assignee: Henkel Corporation
    Inventors: Shailesh Shah, Robert M. Moon