Patents by Inventor Robert M. Morton

Robert M. Morton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8018384
    Abstract: In an illustrative embodiment, an apparatus includes at least one antenna structure located on a first surface of a first substrate; at least one pad located on the first surface of the first substrate; and at least one via traversing the first substrate and thereby connecting the at least one pad located on the first surface of the first substrate to at least one pad located on a second surface. The at least one pad located on the first surface of the first substrate is operatively coupleable to at least one pad located on a surface of an integrated circuit and the at least one pad located on the second surface is operatively coupleable to at least one pad located on a surface of a printed circuit board. The at least one via is thereby operative to couple the at least one pad located on the surface of the integrated circuit and the at least one pad located on the surface of the printed circuit board.
    Type: Grant
    Filed: May 30, 2008
    Date of Patent: September 13, 2011
    Assignee: International Business Machines Corporation
    Inventors: Brian Allan Floyd, Duixian Liu, Robert M. Morton
  • Publication number: 20090015485
    Abstract: In an illustrative embodiment, an apparatus includes at least one antenna structure located on a first surface of a first substrate; at least one pad located on the first surface of the first substrate; and at least one via traversing the first substrate and thereby connecting the at least one pad located on the first surface of the first substrate to at least one pad located on a second surface. The at least one pad located on the first surface of the first substrate is operatively coupleable to at least one pad located on a surface of an integrated circuit and the at least one pad located on the second surface is operatively coupleable to at least one pad located on a surface of a printed circuit board. The at least one via is thereby operative to couple the at least one pad located on the surface of the integrated circuit and the at least one pad located on the surface of the printed circuit board.
    Type: Application
    Filed: May 30, 2008
    Publication date: January 15, 2009
    Inventors: Brian Allan Floyd, Duixian Liu, Robert M. Morton
  • Patent number: 3963986
    Abstract: A programmable interface contactor structure including a plurality of discrete electrical probes geometrically arranged, or oriented, to respectively electrically contact a discrete one of an array of conductive pads on a device under test. The plurality of discrete probes are contained and supported within a structure having a generally planar exposed upper surface where one end portion of each of said plurality of probes is electrically connected to a single conductive pad contained within an array of pads on said planar surface of the probe assembly. The contactor structure further includes a space transformer having a generally cylindrical overall configuration.
    Type: Grant
    Filed: February 10, 1975
    Date of Patent: June 15, 1976
    Assignee: International Business Machines Corporation
    Inventors: Robert M. Morton, Ariel L. Perlmann