Patents by Inventor Robert M. Murco

Robert M. Murco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Direct chip attachment (DCA) with electrically conductive adhesives
    Patent number: 5543585
    Abstract: A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: August 6, 1996
    Assignee: International Business Machines Corporation
    Inventors: Richard B. Booth, Michael A. Gaynes, Robert M. Murco, Viswanadham Puligandla, Judith M. Roldan, Ravi Saraf, Jerzy M. Zalesinski