Patents by Inventor Robert M. Schaedel

Robert M. Schaedel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11332628
    Abstract: The present disclosure relates to a filamentary structure manufactured during 3D printing by liquid deposition modelling, the filamentary structure comprising a continuous strand comprising a matrix material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets. The present disclosure further relates to a 3D printable ink composition for manufacturing said filamentary structure, to a 3D printed component part formed from said filamentary structure, to a 3D printing method for making said 3D printed component part, and to the use of said component part.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: May 17, 2022
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Robert M. Schädel, Krishna B. Uibel, Stefanie Wildhack
  • Publication number: 20210340391
    Abstract: The present disclosure relates to a filamentary structure manufactured during 3D printing by liquid deposition modelling, the filamentary structure comprising a continuous strand comprising a matrix material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets. The present disclosure further relates to a 3D printable ink composition for manufacturing said filamentary structure, to a 3D printed component part formed from said filamentary structure, to a 3D printing method for making said 3D printed component part, and to the use of said component part.
    Type: Application
    Filed: August 27, 2019
    Publication date: November 4, 2021
    Inventors: Robert M. Schädel, Krishna B. Uibel, Stefanie Wildhack
  • Publication number: 20210323222
    Abstract: The present disclosure relates to a filamentary structure manufactured during 3D printing by fused filament fabrication, the filamentary structure comprising a continuous strand comprising a thermoplastically workable material and filler particles, wherein the filler particles comprise hexagonal boron nitride particles comprising hexagonal boron nitride platelets. The present disclosure further relates to a 3D printable filament for manufacturing said filamentary structure, to a 3D printed component part formed from said filamentary structure, to a 3D printing method for making said 3D printed component part, and to the use of said component part.
    Type: Application
    Filed: August 27, 2019
    Publication date: October 21, 2021
    Inventors: Robert M. Schädel, Krishna B. Uibel, Stefanie Wildhack
  • Publication number: 20200385625
    Abstract: The present disclosure relates to a powder composition comprising first and second agglomerates of inorganic particles, to a polymer composition comprising a polymer and said powder composition, and to a composite article made from said polymer composition. The present disclosure further relates to a process for producing said powder composition and to a process for making said composite article, and to the use of said powder composition as thermal conduction means to control the temperature of electrical and electronic components or assemblies or batteries. The present disclosure further relates to a kit of parts for producing said powder composition.
    Type: Application
    Filed: December 18, 2018
    Publication date: December 10, 2020
    Inventors: Christoph Lesniak, Robert M. Schädel, Krishna B. Uibel
  • Patent number: 10829417
    Abstract: Provided are formed bodies comprising hexagonal boron nitride wherein the formed body has a Brinell hardness of at least 2 HBW 2,5/2, and wherein the formed body is obtainable by a process at temperatures of at most 100° C., and wherein the Brinell hardness is measured according to DIN EN ISO 6506-1 (2013). Further provided are processes for making said formed body.
    Type: Grant
    Filed: June 15, 2017
    Date of Patent: November 10, 2020
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Krishna B. Uibel, Jan C. Zimmer, Christoph Lesniak, Robert M. Schädel
  • Publication number: 20190177234
    Abstract: Provided are formed bodies comprising hexagonal boron nitride wherein the formed body has a Brinell hardness of at least 2 HBW 2,5/2, and wherein the formed body is obtainable by a process at temperatures of at most 100° C., and wherein the Brinell hardness is measured according to DIN EN ISO 6506-1 (2013). Further provided are processes for making said formed body.
    Type: Application
    Filed: June 15, 2017
    Publication date: June 13, 2019
    Inventors: Krishna B. Uibel, Jan C. Zimmer, Christoph Lesniak, Robert M. Schädel
  • Publication number: 20180355223
    Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii.
    Type: Application
    Filed: December 6, 2016
    Publication date: December 13, 2018
    Inventors: Jan U. Wieneke, Susanne H. Rieder-Otterburg, Armin Kayser, Krishna B. Uibel, Martin Engler, Robert M. Schaedel, Takujiro Yamabe