Abstract: A protein free glaze forming composition is provided which is storage stable at room temperature. The glaze forming composition includes water, a modified food starch, one or more antibacterial preservatives, a vegetable gum, an alginate and an edible food grade acid. The resulting composition is storage stable at room temperature. It is protein and milk free. It is also sugar free. In use, the surface glaze is sprayed on the bakery product either before or after baking to provide a high gloss shine. The surface glaze composition according to the invention is particularly useful on pies to provide a glaze that is crack resistant and on baked products with flaky crusts.

Abstract: The pan release coating is provided which includes water, mono and diclycerides, polysorbate, and an antimicrobial effective amount of acetic acid, citric acid and sodium benzoate. Desirably, the composition of the present invention is composed of water in an amount of 77% to 95% by weight, acetic acid in the amount of 0.3 to 1% by weight, citric acid in the amount of 0.02 to 1.0% by weight, sodium benzoate in an amount of 0.02 to 0.3% by weight, monoglycerides and diglycerides in the amount of 2 to 8% by weight and polysorbate in the amount of 2 to 7% by weight. Desirably, lecithin is also included. The resulting product has a pH of 4.5 or below, desirably between about 3.5 and 4.5, and most desirably a pH of 3.6 to 3.9. The product has a shelf life of 12 months or longer at room temperature, without refrigeration or a sealed container.

Abstract: A composite facer material for use with cementitious wallboards, where the composite facer is embedded in a top and bottom face thereof. The composite facer material, in a most preferred embodiment, comprises two layers. The first layer is preferably a carded polyester nonwoven mat, which is bonded to a second layer comprising preferably a tri-directional laid scrim fabric reinforcement layer made of continuous glass fibers. The two layers are preferably bonded together using an acrylic adhesive, which offers superior adhesion between the layers as well as superior adhesion between the composite facing material and the cementitious core.

Abstract: A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.

Abstract: Method of, system for, and computer program product for providing a central repository for information regarding run time library usage and a run time subsytem for using the run time libraries in accordance with the information contained in the central repository. The run time subsystem loads run time libraries when initialized and when requested to do by requests from application programs in accordance with the information contained in the central repository. The run time subsystem's use of the central repository provides improved application program performance, improved system utilization, and improved migration.

Abstract: A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.

Abstract: A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.

Abstract: An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets.

Abstract: A high throughput sputtering apparatus which provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus comprises a plurality of buffer and sputtering chambers which include an input end and an output end. The substrates are transported through the chambers at varying rates of speed such that the rate of speed of a pallet from the input end to the output end is a constant for each of the pallets.

Abstract: An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets.

Abstract: A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.

Abstract: Apparatus for measuring the velocity of shaping air in a rotary bell atomizer for a paint sprayer, including a funnel that collects substantially all of the shaping air, a means for straightening the collected shaping air and a means for measuring the velocity of the straightened shaping air. These techniques enable the average velocity of the shaping air to be calibrated from a single velocity sample.

Abstract: An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets.

Abstract: A treatment device such as a filter device, containing a treatment bed (2) of particulate treatment medium. A fluidizing unit (9) associated with the treatment medium particles, for removing the treatment medium particles from the treatment bed for rejuvenation. The fluidizing unit (9) comprises a liquid supply duct (11) having an outlet (10) and which is arranged to be fed with liquid under pressure from outside the filter bed, and a discharge duct (14) having an inlet (15) and which projects beyond the outlet (10) of the liquid supply duct.

Abstract: A condition handling method and means capable of handling programs written in a plurality computer programming languages is created by a set of routines which implement the Common Condition Handling (CCH) function. These routines have entry points which are declared as external or entry variables which enables application programs to link to them. The compilers and application programs can then interact with the condition handling process by calling or branching to the entry points in the common condition handling code when the program is executing. Language specific condition handling routines and user condition handlers are invoked using a last-in-first-out (LIFO) queue to associate the handlers with the current stack frame. Any handler may respond to the CCH with one of three types of requests: Resume, Percolate, and Promote. A separate means is provided for registering Exit Handlers and to move the resume cursor.

Abstract: A water management system is disclosed comprising a first distribution system having a wastewater outlet connected to a settling chamber, which has an overflow to a discharge chamber. The settling chamber has a means for removing settled solids comprising a fluidizing duct having a supply unit connected to a source of water under pressure and a discharge duct within the supply duct for discharge of a slurry of solids from the settling chamber. The discharge chamber is connected to a storage tank for supplying treated water to a second water distribution system.

Abstract: A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.

Abstract: A method of raising material, such as production fluid (6), from a bore hole (3) involves pumping water down a pipe (7) to a fluidising unit (A) so that the water activates and entrains the material and carries it up through a discharge conduit (8) to a separator (B).

Abstract: An improved method and system is described for generalized handling of conditions occurring during program execution in a computer system having a multi-language Condition Manager (CM). A general signaling routine having object code for an external entry point suitable for linking to application programs written in any language supporting external calls is used. The signaling routine may be used by programs to eliminate the step of checking return codes from subroutines by coding the subroutine to automatically signal the proper condition to the CM which in conjunction with user defined condition handlers takes proper actions in response to the condition. A general condition token which may be used as a feedback token is defined as a condition identifier, a format code for the condition identifier, a severity code for the condition, a control code for a facility identifier, a facility identifier and an optional handle for instance specific information.

Abstract: A thread seal comprises a helical rib (6) for use with a threaded member (1). The end portions (7) of the rib (6) are axially staggered and are joined by a transverse thread bridging member (8) which engages a crest (9) of the thread between successive turns of the groove (2). The rib (6) has a tapering cross-section to project radially into the groove (2) and to form a lip seal over a limited axial width of the groove (2) throughout the greater part of the circumferential length of the rib (6). The end portions (7) together with the bridging member (8) are shaped to form a seal over the full axial width of the thread profile. By limiting the area of contact between the rib (6) and groove (2) over the greater part of the circumferential length of the rib (6) the frictional force between them is reduced.