Patents by Inventor Robert M. Wade

Robert M. Wade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for continuous production of a multilayer electric cable and materials therefor
    Patent number: 4469538
    Abstract: An improved multilayer electric cable is disclosed having a conductive core, an extruded strand shield (ESS) layer, an insulating layer of polymeric insulation material surrounding the core and coaxial therewith, a semi-conductive insulation shield (EIS) layer strippably bonded to the insulation layer surrounding it and coaxial therewith and, preferably, a plurality of axially extending drain wires disposed within the semiconductive EIS layer. The semi-conductive EIS layer is formed of a copolymer of an ethylene/alkylacrylate/monoalkyl ester of 1,4-butenedioic acid copolymer, conductive carbon black, and a peroxide curing agent and preferably also a copolymer of ethylene and propylene or a copolymer of ethylene, propylene and an unconjugated diene. The semi-conductive EIS layer is applied by extrusion at elevated temperature in a dry gas atmosphere.
    Type: Grant
    Filed: February 22, 1983
    Date of Patent: September 4, 1984
    Assignee: Anaconda-Ericsson, Inc.
    Inventors: Robert M. Wade, George N. Benjamin, Marwick H. Solomon, Daniel H. Jessop
  • Process for continuous production of a multilayer electric cable
    Patent number: 4469539
    Abstract: An improved multilayer electric cable is disclosed having a conductive core, an extruded strand shield (ESS) layer, an insulating layer of polymeric insulation material surrounding the core and coaxial therewith, a semiconductive insulation shield (EIS) layer strippably bonded to the insulation layer surrounding it and coaxial therewith and, preferably, a plurality of axially extending drain wires disposed within the semiconductive EIS layer. The semiconductive EIS layer is formed of a copolymer of an ethylene/acrylate/monoalkyl ester of 1,4-butenedioic acid copolymer, conductive carbon black, a peroxide curing agent and polyethylene or polyethylene copolymer. The semiconductive EIS layer is applied by extrusion at elevated temperature in a dry gas atmosphere.
    Type: Grant
    Filed: June 22, 1983
    Date of Patent: September 4, 1984
    Assignee: Anaconda-Ericsson, Inc.
    Inventors: Robert M. Wade, George N. Benjamin, Marwick H. Solomon, Daniel H. Jessop
  • Nonmetallic-sheathed cable
    Patent number: 3936591
    Abstract: Nonmetallic-sheathed cable is insulated and jacketed with expanded polyvinyl chloride comprising 8-24%, by volume, of gas.
    Type: Grant
    Filed: July 5, 1974
    Date of Patent: February 3, 1976
    Assignee: The Anaconda Company
    Inventors: Lambert C. Smith, Verne A. Meridith, Robert M. Wade