Patents by Inventor Robert M. Ward

Robert M. Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071917
    Abstract: Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 29, 2024
    Inventors: Richard E. SCHENKER, Robert L. BRISTOL, Kevin L. LIN, Florian GSTREIN, James M. BLACKWELL, Marie KRYSAK, Manish CHANDHOK, Paul A. NYHUS, Charles H. WALLACE, Curtis W. WARD, Swaminathan SIVAKUMAR, Elliot N. TAN
  • Patent number: 8139369
    Abstract: A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
    Type: Grant
    Filed: April 14, 2008
    Date of Patent: March 20, 2012
    Assignee: Lockheed Martin Corporation
    Inventors: Jeremy F. Weinstein, Robert M. Ward
  • Publication number: 20090258511
    Abstract: A printed wiring board includes solder pads to which component leads may be soldered. L-shaped solder pads of the printed wiring board allow component leads to approach the board from any of the four major sides of the printed wiring board. Each solder pad includes two legs and two respective axes. A component lead may be selectively soldered to one of the two legs of the solder pad. Thus, a component lead may approach a solder pad from one of four orthogonal directions.
    Type: Application
    Filed: April 14, 2008
    Publication date: October 15, 2009
    Applicant: LOCKHEED MARTIN CORPORATION
    Inventors: Jeremy F. Weinstein, Robert M. Ward
  • Patent number: 6688337
    Abstract: An apparatus and method for sealing an underground junction between a lateral service line and a main pipeline from the inside-out. One embodiment provides a substantially rigid patching apparatus which may be positioned and installed with a robotic device within a main pipeline. The patching apparatus has a flange shaped to fit the internal diameter of the main pipeline and a tubular stem or sleeve which penetrates into the lateral service line. The patching apparatus contains an interconnection substrate such as felt, sponge or other similar material. The interconnection substrate may be impregnated with a bonding agent which sealingly interconnects the patching apparatus to the main pipeline and lateral service line, and may be heated by utilizing a heating element within a support cage, thus reducing the time required for curing.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: February 10, 2004
    Inventor: Robert M. Ward
  • Publication number: 20030116211
    Abstract: An apparatus and method for sealing an underground junction between a lateral service line and a main pipeline from the inside-out. One embodiment provides a substantially rigid patching apparatus which may be positioned and installed with a robotic device within a main pipeline. The patching apparatus has a flange shaped to fit the internal diameter of the main pipeline and a tubular stem or sleeve which penetrates into the lateral service line. The patching apparatus contains an interconnection substrate such as felt, sponge or other similar material. The interconnection substrate may be impregnated with a bonding agent which sealingly interconnects the patching apparatus to the main pipeline and lateral service line, and may be heated by utilizing a heating element within a support cage, thus reducing the time required for curing.
    Type: Application
    Filed: December 19, 2001
    Publication date: June 26, 2003
    Inventor: Robert M. Ward
  • Patent number: 6206049
    Abstract: An apparatus and method for sealing an underground junction between a lateral service line and a main pipeline from the inside-out. One embodiment provides a substantially rigid patching apparatus which may be positioned and installed with a robotic device within a main pipeline. The patching apparatus has a flange shaped to fit the internal diameter of the main pipeline and a tubular stem or sleeve which penetrates into the lateral service line. The patching apparatus contains an interconnection substrate such as felt, sponge or other similar material. The interconnection substrate may be impregnated with a bonding agent which sealingly interconnects the patching apparatus to the main pipeline and lateral service line, and may be heated by utilizing a heating element within a support cage, thus reducing the time required for curing.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: March 27, 2001
    Assignee: Tele Environmental Systems
    Inventor: Robert M. Ward
  • Patent number: 6082411
    Abstract: An apparatus and method for sealing an underground junction between a lateral service line and a main pipeline from the inside-out. One embodiment provides a substantially rigid patching apparatus which may be positioned and installed with a robotic device within a main pipeline. The patching apparatus has a flange shaped to fit the internal diameter of the main pipeline and a tubular stem or sleeve which penetrates into the lateral service line. The patching apparatus contains an interconnection substrate such as felt, sponge or other similar material. The interconnection substrate may be impregnated with a bonding agent which sealingly interconnects the patching apparatus to the main pipeline and lateral service line. The seal provided by the inverted-tee patch effectively eliminates most water intrusion or the influx of plant roots and other matter which can seriously damage or obstruct the main pipeline.
    Type: Grant
    Filed: October 22, 1999
    Date of Patent: July 4, 2000
    Assignee: Tele Environmental Systems
    Inventor: Robert M. Ward
  • Patent number: 5971032
    Abstract: An apparatus and method for sealing an underground junction between a lateral service line and a main pipeline from the inside-out. One embodiment provides a substantially rigid patching apparatus which may be positioned and installed with a robotic device within a main pipeline. The patching apparatus has a flange shaped to fit the internal diameter of the main pipeline and a tubular stem or sleeve which penetrates into the lateral service line. The patching apparatus contains an interconnection substrate such as felt, sponge or other similar material. The interconnection substrate may be impregnated with a bonding agent which sealingly interconnects the patching apparatus to the main pipeline and lateral service line. The seal provided by the inverted-tee patch effectively eliminates most water intrusion or the influx of plant roots and other matter which can seriously damage or obstruct the main pipeline.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: October 26, 1999
    Assignee: Tele Environmental Systems
    Inventor: Robert M. Ward
  • Patent number: 5784695
    Abstract: A method and apparatus are provided for controlling mobile and base stations (14 and 16) during satellite (12) based telecommunications to perform scheduled handovers between two communications channels (26 and 27). The base station (16) determines when a handover will be necessary. Once determined, the base station (16) generates a handover scheduling command (node #4) which includes a scheduled handover time representing a time in the future at which the handover will occur. The handover scheduling command is transmitted over the first channel to the mobile station (14). Upon receipt of the handover scheduling command, the mobile station (14) performs steps necessary to establish a second communications link over a second channel (27), prior to the scheduled handover time. At the scheduled handover time (node #21), the mobile and base stations (14 and 16) have established the second communications link on the second channel (27).
    Type: Grant
    Filed: May 14, 1996
    Date of Patent: July 21, 1998
    Assignee: TRW Inc.
    Inventors: Eric L. Upton, Robert M. Ward, Jr.
  • Patent number: 5673353
    Abstract: A fiber preform structure, preferably of an optical glass for use in making fibers and lenses, constructed with a central core of a first material, a surrounding tube of a second material, and a deeply placed bonded layer integrally formed between the core and tube preferably by a heat driven interdiffusion of the first and second materials. The deeply placed interface layer of the resulting preform structure exhibits material characteristics related to the interdiffused material characteristics of the rod and tube materials. The interdiffusion is preferably performed while supporting the combined rod and tube structure. The preform is rotated during heating to maintain the geometric symmetry of the preform and of the interface layer. An encapsulating carrier is used to support the preform in all dimensions during heating.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: September 30, 1997
    Inventors: Robert M. Ward, David N. Pulsifer
  • Patent number: 5522003
    Abstract: A glass preform structure, preferably of an optical glass, constructed with a central core of a first material, a surrounding tube of a second material, and a deeply placed bonded layer integrally formed between the core and tube preferably by a heat driven interdiffusion of the first and second materials. The deeply placed interface layer of the resulting preform structure exhibits material characteristics related to the interdiffused material characteristics of the rod and tube materials. The interdiffusion is preferably performed while supporting the combined rod and tube structure. The preform is rotated during heating to maintain the geometric symmetry of the preform and of the interface layer. An encapsulating carrier is used to support the preform in all dimensions during heating.
    Type: Grant
    Filed: March 2, 1993
    Date of Patent: May 28, 1996
    Inventors: Robert M. Ward, David N. Pulsifer