Abstract: An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120° C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50° C. following activation of the initiator.

Abstract: An actinic radiation activated, thermally curable solid film adhesive is disclosed that includes a film forming polymeric binder, a cationically curable resin, and a cationic photoinitiator. The solid film adhesive is capable of being processed at temperatures up to 120° C. prior to exposure to actinic radiation without curing, has a latency period at room temperature following activation of the initiator, and is curable at temperatures above 50° C. following activation of the initiator.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20° C., optionally a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50° C. When blended with at least one liquid epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be cured.

Abstract: A method for the production of glass or plastic laminates is provided comprising applying between opposing faces of glass or plastic substrates a pressure sensitive adhesive comprised of a curable blend of an epoxy resin and a polymer comprised of the polymerization reaction product of an alkyl (meth)acrylate monomer whose homopolymer has a Tg>20° C., optionally a C1-30 (meth)acrylate monomer, a nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the monomers being present in an amount such that the copolymer has a Tg>50° C., and curing the adhesive.

Abstract: A method of production of veneer assemblies is provided wherein a thermocurable adhesive is placed along the joint between adjacent veneer sheets and a core substrate and subjected to heat pressing to bond the veneer to the core substrate.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20° C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50° C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.

Abstract: A method of production of veneer assemblies is provided wherein an adhesive tape is placed along the joint between adjacent veneer sheets and a core substrate and subjected to heat pressing to bond the veneer to the core substrate.

Abstract: A high Tg acrylic polymer is provided as well as an epoxy-blend thereof for use as a pressure sensitive adhesive. The high Tg acrylic polymer comprises a copolymer of an alkyl (meth)acrylate monomer having a Tg>20° C., a C1-30 (meth)acrylate monomer, an nitrogen-containing polar monomer, and a polymerizable epoxy-containing monomer, with the polymer having a Tg>50° C. When blended with an epoxy resin, the resulting mixture exhibits desirable pressure sensitive adhesive properties and may be thermocured.