Patents by Inventor Robert Magette

Robert Magette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting a component to a printed circuit assembly
    Patent number: 6178624
    Abstract: A method for attaching processors and other components to printed circuit assemblies. One particularly useful application for several embodiments of the invention is attaching a single-edge-contact processor to a PCB. In one embodiment, a mounting-module for attaching a component to a PCB is attached to the PCB prior to being shipped to a final device manufacturer. The component has a component height greater than a desired shipping height for the printed circuit board. The mounting-module, more particularly, may have a base attached to the printed circuit board and a component holder attachable to the base. The base and component holder together may have a first height less than the desired shipping height when the component holder is in a detached or lowered position. As such, the base may be attached to the printed circuit board prior to shipping without adversely impacting the shipping costs.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: January 30, 2001
    Assignee: Micron Electronics, Inc.
    Inventor: Robert Magette
  • Component mounting module for printed circuit assemblies
    Patent number: 6031715
    Abstract: An apparatus for attaching processors and other components to printed circuit assemblies. One particularly useful application for several embodiments of the invention is attaching a single-edge-contact processor to a PCB. In one embodiment, a mounting-module for attaching a component to a PCB is attached to the PCB prior to being shipped to a final device manufacturer. The component has a component height greater than a desired shipping height for the printed circuit board. The mounting-module, more particularly, may have a base attached to the printed circuit board and a component holder attachable to the base. The base and component holder together may have a first height less than the desired shipping height when the component holder is in a detached or lowered position. As such, the base may be attached to the printed circuit board prior to shipping without adversely impacting the shipping costs.
    Type: Grant
    Filed: November 19, 1997
    Date of Patent: February 29, 2000
    Assignee: Micron Electronics, Inc.
    Inventor: Robert Magette