Abstract: Fluidic devices may include a monolithic gate substrate and a channel substrate coupled to the monolithic gate substrate. The monolithic gate substrate may include a gate chamber and a flexible membrane located adjacent to the gate chamber. The channel substrate may include a source channel and a drain channel that are in fluid communication with the flexible membrane on an opposite side of the flexible membrane from the gate chamber. Various other related devices, systems, and methods are also disclosed.

Abstract: The disclosed microfluidic valves may include a valve body having at least one cavity therein, a gate transmission element separating the cavity into an input gate terminal and an output gate terminal, a gate port configured to convey drive fluid into the input gate terminal, and a fluid channel. The gate transmission element may include a flexible membrane and a plunger coupled to the flexible membrane. The gate transmission element may be configured to move within the cavity to inhibit a subject fluid flow from an inlet port to an outlet port of the fluid channel upon pressurization of the input gate terminal, and to allow subject fluid flow from the inlet port to the outlet port upon depressurization of the input gate terminal. Various other related systems and methods are also disclosed.

Abstract: An electrostatic zipping actuator includes a primary electrode, a secondary electrode overlying the primary electrode, a dielectric layer located between and abutting at least a portion of the primary electrode and the secondary electrode, and a dielectric fluid disposed at least at a junction between the dielectric layer and one of the electrodes, where an average total thickness of the dielectric layer is less than approximately 10 micrometers.

Abstract: A pick-up head assembly comprises a body of a liquid crystalline elastomer (LCE) that undergoes a reversible expansion when exposed to a first frequency of light and contracts when exposed to a second frequency of light. Selective portions of the LCE in the pick-up head assembly are irradiated with the first frequency to cause an expansion in the selective portions. The adhesive forces of the expanded portions of the LCE are used to pick-up semiconductor devices from a first substrate. The semiconductor devices are placed on a second substrate by exposing the expanded portions of the LCE to the second frequency of light, causing the expanded portions to contract.

Abstract: The disclosed method of manufacturing may include positioning a membrane on top of a channeled layer where the channeled layer includes a shim portion that is dimensioned to limit the amount of compression appliable to the membrane. The membrane may be positioned at a juncture in the channeled layer. The method may next include positioning a transmission housing layer membrane and the channeled layer. The method may also include fastening the channeled layer, the membrane, and the transmission housing layer together. The channeled layer, the membrane, and the transmission housing layer may be held together with at least one fastening member. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An electrostatic zipping actuator includes a primary electrode, a secondary electrode overlying the primary electrode, a dielectric layer located between and abutting at least a portion of the primary electrode and the secondary electrode, and a dielectric fluid disposed at least at a junction between the dielectric layer and one of the electrodes, where an average total thickness of the dielectric layer is less than approximately 10 micrometers.

Abstract: A method and system for assembling a device by picking up semiconductor devices from a carrier substrate and placing the semiconductor devices onto a target substrate. The transfer of the semiconductor devices uses fluid as a transfer medium. The fluid enters a fluid channel of a pickup head, causing the pickup head to expand, make contact with, and attach to an aligned semiconductor device. After the semiconductor device is aligned with and placed onto the target substrate, at least a portion of the fluid is removed from the pickup head to release the semiconductor device onto the target substrate. The semiconductor device bonds to the target substrate.

Abstract: The disclosed microfluidic valves may include a valve body having at least one cavity therein, a gate transmission element separating the cavity into an input gate terminal and an output gate terminal, a gate port configured to convey drive fluid into the input gate terminal, and a fluid channel. The gate transmission element may include a flexible membrane and a plunger coupled to the flexible membrane. The gate transmission element may be configured to move within the cavity to inhibit a subject fluid flow from an inlet port to an outlet port of the fluid channel upon pressurization of the input gate terminal, and to allow subject fluid flow from the inlet port to the outlet port upon depressurization of the input gate terminal. Various other related systems and methods are also disclosed.

Abstract: Plastic tubing including a thermoplastic ribbon helically wrapped and heat bonded to itself to form a tubing wall and a thermoplastic reinforcement located helically around and along the tubing wall. At least a thickness of the tubing wall or a size of the thermoplastic reinforcement is varied along the tubing wall.

Abstract: Plastic tubing including a thermoplastic ribbon helically wrapped and heat bonded to itself to form a tubing wall and a thermoplastic reinforcement located helically around and along the tubing wall. At least a thickness of the tubing wall or a size of the thermoplastic reinforcement is varied along the tubing wall.

Abstract: Plastic tubing including a thermoplastic ribbon helically wrapped and heat bonded to itself to form a tubing wall and a thermoplastic reinforcement located helically around and along the tubing wall. At least a thickness of the tubing wall or a size of the thermoplastic reinforcement is varied along the tubing wall.

Abstract: Plastic tubing including a thermoplastic ribbon helically wrapped and heat bonded to itself to form a tubing wall and a thermoplastic reinforcement located helically around and along the tubing wall. At least a thickness of the tubing wall or a size of the thermoplastic reinforcement is varied along the tubing wall.

Abstract: Methods and systems are disclosed for delivering content to users. In one embodiment, a computer system obtains text associated with a content item, where the text comprises: text from a transcript associated with a content item, when available; text from a web feed (e.g., an RSS feed, etc.) associated with the content item, when available; text from a webpage associated with the content item, when available; and text that is returned from a call to an application programming interface (API) of a provider of the content item, when available. The computer system then determines a set of entities based on the obtained text.