Abstract: Circuits and methods that can rapidly detect voltage degradation in a positive charge pump output and discharge control node accumulated charge (CNAC), thereby forcing the positive charge pump into a high-power mode. Embodiments include circuitry configured to provide a load current to a positive charge pump, including a low-dropout regulator (LDO) having a pass device that includes a control input, and a rapid charge transfer circuit coupled to the control input of the pass device and configured to be coupled to a source of a trigger voltage, the rapid charge transfer circuit configured to transfer a charge to or from the control input of the pass device when the trigger voltage falls sufficiently below a specified level so as to rapidly place the pass device in a higher conduction state, and to automatically cease to provide the transfer the charge after a settable amount of time.

Abstract: Circuits and methods that compensate for the problems created by low-dropout regulator (LDO) leakage current, particularly when stressed. Embodiments include an improved LDO configured to provide a load current, and which includes a leakage current compensation circuit. The leakage current compensation circuit generates a compensating current that offsets the leakage current through the pass device of the LDO during conditions that induce such leakage. More specifically, the leakage current compensation circuit can replicate the leakage current of the pass device of the LDO and feed a compensating current back into the LDO from a current mirror circuit while drawing zero-power during normal use, when leakage current is absent. LDO circuits that include a leakage current compensation circuit are particularly useful as voltage sources for positive or negative charge pumps, but are also quite useful in applications requiring a regulated voltage output.

Abstract: Circuits and methods for defining functionality of swappable pins are provided. A power-on-reset (POR) circuit detects that a supply voltage is above a POR threshold during start-up or a reset operation. Transmission gate circuits monitor inputs from a first pin and the second pin and deactivate once the POR circuit detects that the supply voltage is above the POR threshold. A latch circuit receives outputs of the transmission gate circuits as inputs. Once the supply voltage is above the POR threshold, the latch circuit generates a first output corresponding to the first pin, and a second output corresponding to the second pin, where the first pin is defined as a I/O pin and the second pin is defined as a capacitance pin or vice versa based on the first output and the second output.

Abstract: Charge pump circuits having a fractional negative voltage output from a positive voltage input. A control circuit provides for feedback control of the output of such a charge pump, and may include dynamic adjustment of the charge pump output based on one or more factors. In some embodiments, two or more charge pumps are coupled in a differential configuration such that while one set of capacitors are in series charging, at least one other set of capacitors is discharging. One embodiment encompasses a fractional negative voltage charge pump including n?2 capacitors configured to be coupled in series between an input voltage and ground during a charging phase, and in parallel between ground and an output terminal during a discharging phase. The fractional negative voltage charge pump outputs a negative voltage that is no more than 1/n of a positive voltage input in magnitude.

Abstract: Circuits and methods for determining the characteristics of swappable pins in a peripheral in a 1-Wire or similar single-conductor system, thereby allowing each one of two pins to be either an I/O pin (connected to an I/O line) or a CAP pin (connected to a storage capacitor). Embodiments may utilize a hybrid buffer circuit that utilizes an effectively bi-directional PFET pull-up device coupled between the swappable pins A and B. Two open-drain NFETs pull-down devices are used, one on either side of the PFET and coupled to a respective pin (A or B), but with only one NFET being selected to be operable based on pin-determination flag signals from the pin detection circuitry. Such a hybrid buffer circuit would consume significantly less IC area than two complete conventional buffers, resulting in less leakage and less yield loss.

Abstract: Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals are described. Such devices and method include use of symmetrical compensation capacitances, symmetrical series capacitors, or symmetrical sizing of the elements of the stack.

Abstract: Circuits and methods for defining functionality of swappable pins are provided. A power-on-reset (POR) circuit detects that a supply voltage is above a POR threshold during start-up or a reset operation. Transmission gate circuits monitor inputs from a first pin and the second pin and deactivate once the POR circuit detects that the supply voltage is above the POR threshold. A latch circuit receives outputs of the transmission gate circuits as inputs. Once the supply voltage is above the POR threshold, the latch circuit generates a first output corresponding to the first pin, and a second output corresponding to the second pin, where the first pin is defined as a I/O pin and the second pin is defined as a capacitance pin or vice versa based on the first output and the second output.

Abstract: Circuits and methods for reading fusible links that allows use of low-voltage logic circuitry utilizing devices that may have a high-voltage stand-off capability. Embodiments provide predictable operation that is less susceptible to PVT variations, allow the use of arrays of fuses that may be scaled to relatively large memory sizes, uses little integrated circuit area, and do not require extra pins for operation. Embodiments utilize a latch circuit and voltage dividers to generate a reference voltage VREF and a fuse voltage VFUSE, and then compares and latches the greater of those voltages. The circuitry does not require any more supply voltage than is needed to turn ON input pass transistors to the latch at a slightly higher voltage (VTH) than VREF. Since VREF may be about 0.1V, that turn-ON voltage may be as low as about 0.1V+VTH, and thus would be less than a VDD_MIN of about 1V.

Abstract: Devices and methods for improving voltage handling and/or bi-directionality of stacks of elements when connected between terminals are described. Such devices and method include use of symmetrical compensation capacitances, symmetrical series capacitors, or symmetrical sizing of the elements of the stack.

Abstract: Methods and devices to detect defects in gate oxides of MOSFETs are disclosed. The disclosed methods and devices rely upon current measurements or decay measurements of the voltages across MOS capacitors. The described devices can be implemented in the RF circuits with elements having stringent reliability requirements.

Abstract: Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

Abstract: A controllable temperature coefficient bias (CTCB) circuit is disclosed. The CTCB circuit can provide a bias to an amplifier. The CTCB circuit includes a variable with temperature (VWT) circuit having a reference circuit and a control circuit. The control circuit has a control output, a first current control element and a second current control element. Each current control element has a “controllable” resistance. One of the two current control elements may have a relatively high temperature coefficient and another a relatively low temperature coefficient. A controllable resistance of one of the current control elements increases when the controllable resistance of the other current control element decreases. However, the “total resistance” of the current control circuit remains constant with a constant temperature. The VWT circuit has an output with a temperature coefficient that is determined by the relative amount of current that flows through each current control element of the control circuit.

Abstract: Integrated circuits (ICs) that avoid or mitigate creation of changes in accumulated charge in a silicon-on-insulator (SOI) substrate, particularly an SOI substrate having a trap rich layer. In one embodiment, a FET is configured such that, in a standby mode, the FET is turned OFF while maintaining essentially the same VDS as during an active mode. In another embodiment, a FET is configured such that, in a standby mode, current flow through the FET is interrupted while maintaining essentially the same VGS as during the active mode. In another embodiment, a FET is configured such that, in a standby mode, the FET is switched into a very low current state (a “trickle current” state) that keeps both VGS and VDS close to their respective active mode operational voltages. Optionally, S-contacts may be formed in an IC substrate to create protected areas that encompass FETs that are sensitive to accumulated charge effects.

Abstract: An apparatus for generating a steady state positive voltage (PVS) signal and a steady state negative voltage (NVS) signal is presented. The apparatus includes a bias signal generation module for generating a steady state reference voltage signal (RVS) based on a varying supply voltage signal (VDD), the RVS having a voltage level less than the PVS. The apparatus further includes a positive signal generation module (PSGM) generating the PVS, the PSGM including a first capacitor, the PSGM employing the first capacitor to generate a portion of the PVS based on the RVS. The apparatus further includes a negative signal generation module (NSGM) generating the NVS, the NSGM including a second capacitor, the NSGM employing the second capacitor to generate a portion of the NVS based on the RVS.

Abstract: Circuits and methods for reading fusible links that allows use of low-voltage logic circuitry utilizing devices that may have a high-voltage stand-off capability. Embodiments provide predictable operation that is less susceptible to PVT variations, allow the use of arrays of fuses that may be scaled to relatively large memory sizes, uses little integrated circuit area, and do not require extra pins for operation. Embodiments utilize a latch circuit and voltage dividers to generate a reference voltage VREF and a fuse voltage VFUSE, and then compares and latches the greater of those voltages. The circuitry does not require any more supply voltage than is needed to turn ON input pass transistors to the latch at a slightly higher voltage (VTH) than VREF. Since VREF may be about 0.1V, that turn-ON voltage may be as low as about 0.1V+VTH, and thus would be less than a VDD_MIN of about 1V.

Abstract: A controllable temperature coefficient bias (CTCB) circuit is disclosed. The CTCB circuit can provide a bias to an amplifier. The CTCB circuit includes a variable with temperature (VWT) circuit having a reference circuit and a control circuit. The control circuit has a control output, a first current control element and a second current control element. Each current control element has a “controllable” resistance. One of the two current control elements may have a relatively high temperature coefficient and another a relatively low temperature coefficient. A controllable resistance of one of the current control elements increases when the controllable resistance of the other current control element decreases. However, the “total resistance” of the current control circuit remains constant with a constant temperature. The VWT circuit has an output with a temperature coefficient that is determined by the relative amount of current that flows through each current control element of the control circuit.

Abstract: Integrated circuits (ICs) that avoid or mitigate creation of changes in accumulated charge in a silicon-on-insulator (SOI) substrate, particularly an SOI substrate having a trap rich layer. In one embodiment, a FET is configured such that, in a standby mode, the FET is turned OFF while maintaining essentially the same VDS as during an active mode. In another embodiment, a FET is configured such that, in a standby mode, current flow through the FET is interrupted while maintaining essentially the same VGS as during the active mode. In another embodiment, a FET is configured such that, in a standby mode, the FET is switched into a very low current state (a “trickle current” state) that keeps both VGS and VDS close to their respective active mode operational voltages. Optionally, S-contacts may be formed in an IC substrate to create protected areas that encompass FETs that are sensitive to accumulated charge effects.

Abstract: Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are possible where the amplifier is configured to operate in at least an active mode and a standby mode. Circuital arrangements can reduce bias circuit and stacked transistors standby current during operation in the standby mode and to reduce impedance presented to the gates of the stacked transistors during operation in the active mode while maintaining voltage compliance of the stacked transistors during both modes of operation.

Abstract: Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

Abstract: Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are possible where the amplifier is configured to operate in at least an active mode and a standby mode. Circuital arrangements can reduce bias circuit and stacked transistors standby current during operation in the standby mode and to reduce impedance presented to the gates of the stacked transistors during operation in the active mode while maintaining voltage compliance of the stacked transistors during both modes of operation.